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   <news:title>Dismantled: Q3 2026</news:title>
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   <news:title>Silicon Box passes billion-unit packaging milestone</news:title>
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  <lastmod>2026-10-03T20:47:32Z</lastmod>
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    <news:name>IN Electronics &amp; Design</news:name>
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  <lastmod>2026-10-03T20:47:39Z</lastmod>
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    <news:name>IN Electronics &amp; Design</news:name>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>AMD starts enhanced space-grade Versal sampling</news:title>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>AMD brings Ross agentic AI into embedded tools</news:title>
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  <lastmod>2026-10-05T11:09:00Z</lastmod>
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    <news:name>IN Electronics &amp; Design</news:name>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>Toshiba halves SiC MOSFET threshold drift</news:title>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>onsemi and Synaptics revise merger to $5.7bn</news:title>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>Space Forge gains DARPA semiconductor marketplace status</news:title>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>Aratas starts independent component operations</news:title>
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  <lastmod>2026-10-05T08:19:00Z</lastmod>
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    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>ST adds 75V integrated motor driver family</news:title>
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   <news:publication>
    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>MEMPHIS adds Puya memory products to linecard</news:title>
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  <lastmod>2026-10-03T20:48:46Z</lastmod>
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   <news:publication>
    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>XIVER secures €28m for semiconductor expansion</news:title>
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  <lastmod>2026-10-05T06:44:00Z</lastmod>
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   <news:publication>
    <news:name>IN Electronics &amp; Design</news:name>
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   <news:title>ficonTEC and HTSI scale CPO wafer testing</news:title>
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  <lastmod>2026-10-03T20:48:52Z</lastmod>
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   <news:publication>
    <news:name>IN Electronics &amp; Design</news:name>
    <news:language>en</news:language>
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   <news:title>Applied and Besi broaden advanced packaging R&amp;amp;D</news:title>
   <news:publication_date>2026-10-05T06:15:00Z</news:publication_date>
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