Design engineering
The latest design engineering news and features, covering technology, business news and opinions. Read the latest news, innovations and views for everything from component to application level.
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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MIT twins chip fingerprints for authentication
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Nordson targets traceable coating and soldering
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AI inference pushes NAND supply into constraint
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Samsung ships HBM4 for 11.7Gbps pin speeds
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ROHM shrinks automotive MOSFETs with gull-wings
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ByteSnap and Digi bundle embedded Linux security service
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Recycled titanium bracket completes helicopter flight
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Ireland opens semiconductor competence centre for SMEs
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Taoglas launches AI antenna recommendation engine