Home | IN Electronics & Design

Microelectronics US 2026 sharpens focus on execution across chips, photonics, and embedded systems

Microelectronics US 2026 sharpens focus on execution across chips, photonics, and embedded systems

EPC launches 5kW GaN motor inverter boards for robotics and light EVs

April 16, 2026
Raytheon demonstrates event-based infrared camera for high-speed target tracking

April 16, 2026
RECOM expands into discrete power solutions

April 16, 2026
Zephyr RTOS 4.4 adds WireGuard, Wi‑Fi Direct, and OpenRISC support

April 16, 2026
Advantech and MediaTek secure IEC 62443 certification for RSB-3810

April 16, 2026
Infineon extends automotive semiconductor lead as MCU share rises

April 15, 2026
Microchip expands dsPIC33A family for AI power and sensing control

April 15, 2026
Siemens scales AI chip verification to trillion-cycle prototyping

April 15, 2026

Latest industry news

Safe and Secure targets auditable chips for critical infrastructure

15/4/2026

Safe and Secure targets critical infrastructure with auditable processor security.
Microchip and Sunny Smartlead extend ASA-ML camera module ecosystem

15/4/2026

Microchip Technology and Sunny Smartlead have teamed up on ASA-ML-based…
Synopsys extends Artemis support with lunar EVA and RF modelling

15/4/2026

Synopsys backs Artemis electronics modelling for lunar suits and connectivity.
Emerson launches NI CHESS for aerospace RF link validation

15/4/2026

Emerson launches NI CHESS for lab-based aerospace RF link validation.
Nordson Electronics Solutions takes EM Asia best supplier award at Productronica Shanghai

14/4/2026

Nordson Electronics Solutions has taken the 2025 EM Asia Best…
EBV launches MOVE initiative to speed robotics platform development

14/4/2026

EBV Elektronik has launched a robotics development initiative that brings…

Featured

Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Mar 4

2026

Dismantled: February’s electronics bottlenecks moved further downstream
Feb 20

2026

AI inference pushes NAND supply into constraint
Feb 12

2026

How custom ICs are restoring touch to human-machine interfaces
Feb 3

2026

Dismantled: January 2026
Nov 27

2025

How ASIC applications impact material considerations