Lattice has introduced an AI assistant for FPGA design flows. Prompt connects engineers’ chosen models and IDEs with Radiant compilation, simulation, implementation, and device documentation.
Keysight has joined Verizon’s forum for pre-standard 6G validation work. Its test and emulation expertise will support research into new spectrum, integrated sensing, AI-native networks, and eventual standards alignment.
Arteris has expanded its chiplet interconnect portfolio for multi-die designs. FlexGen Multi-Die extends non-coherent network-on-chip functions across UCIe links while preserving traffic control, quality of service, and design reuse.
Cadence Tensilica IP drives Analog Devices’ next SHARC processor architecture. The SHARC-FX core moves ADI’s automotive DSP platform to 16nm while adding higher performance, AI processing, security, memory, and connectivity capabilities.
BAE Systems will requalify its RH45 radiation-hardened ASIC design platform. The $16 million programme restores a 45nm SOI route for custom space electronics manufactured by GlobalFoundries in New York.
Murata and Smart Eye are combining radar with cabin cameras. The concept fuses 60GHz sensing with AI-based vision for occupant monitoring, child-presence detection, and future software-defined vehicle functions.
Mitsubishi Electric has invested in OptQC’s optical quantum hardware platform. The partnership links photonic computing development with potential industrial applications.
Arteris has extended NoC connectivity across multi-die chiplet boundaries today. FlexGen Multi-Die targets non-coherent AI and high-performance computing architectures.