Category: Design engineering
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VIAVI has added MCP integration to several network testing systems. Engineers can configure, run, and analyse tests using structured AI workflows while retaining review checkpoints for critical actions.
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Axiro has invested in ThinSiC to develop advanced power semiconductors. The partnership links thin-layer silicon carbide processing with commercial access to industrial drives, rail traction, and power infrastructure.
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Euroquartz cavity filters are now available through distributor Saelig Company. The customisable RF designs cover multiple filter responses, specified power handling up to 200 W, and applications in communications and radar equipment.
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Würth Elektronik has detailed vertical copper busbars for high-current PCBs. PowerBusbar PF uses press-fit mounting, modular lengths, and heat-dissipating geometry to reinforce selected current paths on conventional circuit boards.
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Rohde & Schwarz connects AI assistants directly to supported oscilloscopes. MXO AI Connect runs on a local computer, giving compatible models documented instrument commands, measurement access, and a route into repeatable test automation.
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Murata has begun manufacturing miniature connectors for dense RF boards. The SWL series occupies approximately 40% less mounting area than its predecessor and supports testing to 15 GHz.
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Edinburgh will host the £18m UK Advanced Chip Design Academy. The Autumn Budget programme promises commercial design tools, training and opportunities for researchers to prototype, fabricate and test semiconductors.
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Pickering enables remote control of PXI hardware through gateway software. Its gRPC Device Server exposes existing instrument driver functions to Windows and Linux applications without requiring local drivers on every client.
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STMicroelectronics assigns semiconductor research responsibilities across two senior executive roles. Remi El-Ouazzane will become chief technology officer, while Marco Cassis takes the chief strategic officer position from January 2027.
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Rehm combines convection, condensation and vacuum in complex PCB soldering. Its Vision RCC system integrates convection, vapour-phase soldering and vacuum processing, with a stated maximum assembly mass of 25 kg.