Rapidus has signed a UK agreement on semiconductor manufacturing collaboration. The MoU links UK semiconductor strategy with Japan’s advanced 2nm logic manufacturing plans.
Synopsys has released Multiphysics Fusion tools for chip design closure. The flows integrate timing, power, thermal, electromagnetic, multi-die, analogue, and photonic analysis.
Legacy aerospace and satellite platforms face rising connectivity demands. Filtronic CTO Tudor Williams explains how solid-state power amplifiers can replace travelling wave tube amplifiers, improving reliability, reducing maintenance, and enabling higher-throughput links without the cost and complexity of full platform redesigns.
Keysight has expanded RF analysis options for wideband validation work. The XA5 and XA6 platforms target wireless, radar, and spectrum operations.
Murata has added component models to Ansys simulation workflows directly. The Ansys-compatible files cover RF inductors, MLCCs, and power inductors.