GlobalFoundries and Marvell are expanding SiGe manufacturing for optical interconnects. The multi-year agreement adds Burlington capacity for pluggable, near-packaged, and co-packaged optical architectures.
Tower and NewPhotonics are shipping laser-integrated photonic engines at volume. The PH18DA devices support 800G and 1.6T links, with 6.4T near-packaged optics planned for 2027.
Europe captures little value from its growing AI infrastructure market. New research puts EU companies’ semiconductor, server, and cloud shares in single digits despite rapidly expanding demand.
Prodrive has begun shipping its 105-megapixel Runix machine vision camera. The MX105 combines high resolution with triple-digit frame rates for semiconductor inspection, metrology, and industrial imaging.
Elmos secured additional Dortmund wafer capacity through 2028 and beyond. The extension supplements external foundry agreements as the automotive mixed-signal supplier strengthens manufacturing resilience.
Besi will support Tata Electronics’ advanced semiconductor packaging expansion programme. The agreement covers equipment, process readiness, engineering capability and a technology roadmap for the $3 billion Jagiroad facility.
Nexperia and Tata Electronics are linking Indian semiconductor manufacturing stages. The framework covers 300mm MOSFET wafer fabrication, discrete-device assembly and test, and wider technology collaboration.
TMEIC has opened a Texas factory for industrial power electronics. The 280,000 sq ft Twinwood plant will manufacture UPS systems, medium-voltage drives, and related equipment for data-centre, infrastructure, and energy applications.