Category: Electronics
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MACOM has launched a 3.2T optical front-end chipset platform today. Eight 448Gbps PAM-4 channels combine new receiver components with existing high-speed optical drivers.
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GlobalFoundries and Marvell are expanding SiGe manufacturing for optical interconnects. The multi-year agreement adds Burlington capacity for pluggable, near-packaged, and co-packaged optical architectures.
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Tower and NewPhotonics are shipping laser-integrated photonic engines at volume. The PH18DA devices support 800G and 1.6T links, with 6.4T near-packaged optics planned for 2027.
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Europe captures little value from its growing AI infrastructure market. New research puts EU companies’ semiconductor, server, and cloud shares in single digits despite rapidly expanding demand.
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Infineon has launched a compact 120V dual-channel gate driver IC. The 2.2mm device targets dense silicon conversion stages inside next-generation AI server power architectures.
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Micas is expanding Malaysian manufacturing for commercial co-packaged optics systems. The capacity increase covers optical integration, assembly, testing, and clean-room production.
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Mitsubishi Electric has invested in OptQC’s optical quantum hardware platform. The partnership links photonic computing development with potential industrial applications.
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Arteris has extended NoC connectivity across multi-die chiplet boundaries today. FlexGen Multi-Die targets non-coherent AI and high-performance computing architectures.
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Astera Labs has expanded Leo controllers for memory-intensive AI workloads. New devices target accelerator-attached, expanded, pooled, and reusable server memory.
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ETRI has deployed Anritsu VectorStar for broadband GaN MMIC evaluation. The 220GHz platform supports consistent on-wafer characterisation into sub-terahertz frequencies.