Category: Electronics
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Rapidus has signed a UK agreement on semiconductor manufacturing collaboration. The MoU links UK semiconductor strategy with Japan’s advanced 2nm logic manufacturing plans.
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Synopsys has released Multiphysics Fusion tools for chip design closure. The flows integrate timing, power, thermal, electromagnetic, multi-die, analogue, and photonic analysis.
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AMD and Rackspace are scaling dedicated compute for enterprise AI. The 30MW rollout combines Instinct GPUs and EPYC CPUs for governed workloads.
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Commercial UAV production is creating new pressures on battery development strategies. As manufacturers move from low-volume engineering programmes to repeat production, battery packs must deliver more than performance alone, requiring manufacturability, traceability, testing rigour, and supply chain resilience to support sustainable growth.
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Microchip’s Nantes facility now supports tougher aerospace semiconductor qualification demands. Class Y capability strengthens advanced packaging routes for aerospace and defence devices.
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Semiconductor revenue reached $319bn during the first quarter of 2026. Omdia’s figures show an exceptional memory rebound, with DRAM and NAND nearly doubling as AI infrastructure demand reshapes chip-market growth.
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IQE and Tower have signed a multi-year InP epiwafer agreement. The supply deal supports silicon photonics for AI infrastructure.
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Fraunhofer has urged Germany to accelerate applied research-to-industry technology transfer. The call reflects growing pressure on industrial innovation.
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Nexperia has reported resilient first-quarter results despite supply disruption pressures. Back-end expansion is advancing in Malaysia and the Philippines.
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Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration. The 300mm work points beyond silicon logic scaling.