Category: Electronics
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The British Army has trialled private 5G across armoured platforms. Several live video feeds were distributed between vehicles during a dispersed command post experiment on Salisbury Plain.
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ams OSRAM has secured strategic leadership continuity through September 2031. Aldo Kamper will oversee its concentration on optical semiconductors, digital photonics, automotive lighting, and microLED technology.
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CEA-Leti is moving three dimensional integration into future AI architectures. Fine pitch hybrid bonding is being developed alongside new approaches to power, memory, cooling, and test.
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Global silicon wafer shipments rose sharply during 2026’s second quarter. AI demand broadened beyond processors and memory as industrial and automotive semiconductor markets recovered.
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Renesas has raised DDR5 MRDIMM bandwidth to 16,000MT/s for servers. The third generation chipset targets AI and high performance computing platforms while retaining established DDR5 infrastructure.
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Infineon flash has qualified for ASPEED’s latest server management controller. Approved vendor status gives AST2700 designers validated BMC firmware storage.
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SK hynix has begun shipping HBM4 during another record quarter. HBM4E samples, sixth generation DRAM, and 321 layer NAND extend its AI memory roadmap.
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NVIDIA has expanded its toolkit for AI assisted semiconductor engineering. Physics informed models, accelerated solvers, and deeper EDA integrations extend the platform across chip, package, and PCB development.
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Toray’s polymer film could substantially reduce lithium ion collector weight. The copper coated substrate is now being sampled from production equipment.
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Indra integrates radar, guidance, and command electronics for naval defence. Spain’s SILAEM programme will counter missiles, drones, helicopters, and fast boats.