Category: Electronics
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Nordic has added a compact multiprotocol SoC to nRF54L series. The nRF54LC10A supports Bluetooth LE, Thread, Zigbee, Matter, and Channel Sounding.
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Axelera AI has launched Europa for enterprise inference deployments today. The 629-TOPS accelerator is shipping in validated Dell and Supermicro systems.
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EUCLYD has raised over €200 million for AI infrastructure development. The Eindhoven company is combining ASIC compute, memory, packaging, and rack-level design.
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Cognichip has launched ACI Enterprise for full-stack AI chip design. The system connects specification analysis, RTL development, verification, debugging, and PPA optimisation through semiconductor-specific AI models and controlled enterprise data.
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Photonic has proposed a CA$500 million Canadian semiconductor manufacturing facility. Project VANGUARD would provide shared fabrication and packaging capacity for quantum, AI, defence, sensing, and other advanced technology programmes.
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South Korea has widened espionage law to protect strategic technologies. The revised criminal code extends offences beyond enemy states as authorities strengthen protection around semiconductors, AI, batteries, and other high-value technology.
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LG Chem will supply semiconductor-grade IPA feedstock into China directly. A partnership with Jiangyin Jianghua combines Korean production with local purification for Chinese AI-chip and HBM manufacturing.
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Anglia has added Adam Tech through a pan-European franchise agreement. The deal expands its connector, cable, electromechanical, power, and protection offering, with products stocked and available through Anglia Live.
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ASML is examining output above 110 EUV systems in 2028. The potential increase would extend its capacity programme as advanced logic, memory, and AI-related investment drives lithography demand.
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ST has launched VD56GA for lower-cost automotive infrared cabin sensing. The 1.1MP device combines higher infrared sensitivity, integrated image processing, and compact packaging for volume vehicle programmes.