Keysight has certified RFPro for Intel’s latest advanced process technologies. RFIC designers can use process-aligned electromagnetic simulation before committing designs to manufacture.
Cadence and Synopsys have certified advanced Intel foundry design flows. The support spans implementation, sign-off, IP, multiphysics analysis, and heterogeneous packaging.
Astemo is preparing two Bolton inverter lines for automotive production. The £100 million programme includes power-electronics PCB assembly and final inverter manufacturing.
Samsung and Broadcom are aligning memory, foundry, and packaging roadmaps. Their expanded agreement joins HBM supply with advanced-node manufacturing and heterogeneous integration.
Siemens is adding deterministic verification to long-running agentic EDA workflows. The system connects generative automation with established simulation, implementation, test, and sign-off engines for semiconductor and PCB development.
Amkor secured a multiyear NVIDIA advanced-packaging and semiconductor-testing supply agreement. Supported by a $1.5 billion prepayment, the deal expands US AI assembly capacity.
Intel and Fortinet will co-develop Fortinet’s sixth-generation security processor silicon. SP6 will combine custom cybersecurity architecture with Intel design, packaging, manufacturing, and semiconductor intellectual property.
AIXTRON is expanding Malaysian operations around compound-semiconductor manufacturing equipment production. The Penang facility will add assembly, engineering, purchasing, and customer support for systems serving gallium nitride, silicon carbide, and indium phosphide devices.
STMicroelectronics returned to revenue growth as semiconductor demand continued recovering. Second-quarter sales reached $3.49bn, while improving bookings, lower distributor inventories, and rising AI infrastructure demand supported a stronger outlook.