Category: Electronics
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Siemens and Cloudberry are linking European deep-tech developers with industry. The collaboration combines validation environments, engineering support, and specialist capital.
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Cadence has extended agentic automation across PCB and package design. AuraStack coordinates planning, layout, manufacturability, and multiphysics analysis within one engineering environment.
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ZEISS and SurFunction are industrialising laser-written functional metasurfaces across Europe. The collaboration targets optics, sensors, contacts, semiconductor equipment, thermal systems, and medical technology.
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Samsung has begun mass production of its PCIe 6.0 SSD. The PM1763 combines ninth-generation V-NAND, a 4nm controller, high throughput, liquid-cooling optimisation, and hardware security.
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WeEn has introduced silicon-carbide modules spanning four high-voltage classes worldwide. The WMSC family supports solid-state transformers, charging infrastructure, renewable systems, and high-density data-centre power conversion.
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Senzime and Philips will jointly develop integrated patient-monitoring products worldwide. The agreement combines specialist perioperative technology with Philips’ established hospital-monitoring systems and international commercial organisation.
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Volex has taken full ownership of medical manufacturer Kepler SignalTek. The acquisition extends its portfolio into patient-connected cables, devices, and clinical interfaces.
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IQE has secured a $14m wafer order for AI infrastructure. Production at Newport will support high-speed storage, optical communications, and data-centre systems.
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HistoSonics has secured European approval for its image-guided histotripsy system. The clearance opens a phased rollout for non-thermal treatment of selected liver tumours.
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ASML raised its 2026 sales forecast as AI investment accelerates. The revision reflects stronger demand across advanced logic, memory, and lithography capacity.