Category: Electronics
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Siemens and Samsung Foundry are extending advanced-node EDA collaboration flows. The work covers verification, test, packaging, analogue, RF, and implementation.
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CEA-Leti and GlobalFoundries are extending FD-SOI research through Europe’s FAMES. The pilot line targets low-power, sovereign silicon for advanced applications.
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Imec has developed a narrowband receiver for next-generation UWB systems. The 22nm CMOS chip supports IEEE 802.15.4ab operation, improving range, blocker resilience, and low-power positioning performance.
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CGD and NXP are collaborating on GaN power-conversion system designs. The work targets data-centre, automotive, and industrial designs needing higher efficiency and density.
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CSA Catapult will become the UK’s Semiconductor Catapult this summer. The transition broadens support for chip R&D, validation, commercialisation, and AI hardware deployment.
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Cicor has secured a major French defence electronics assembly programme. The award gives its French operation new electronic assembly work with revenue potential above €50m.
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Celera has acquired SiliconGate to expand analogue IC design capability. The deal adds Portuguese power-management expertise, silicon-proven IP, and design capacity for custom semiconductor development.
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Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.
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Semiconductor equipment billings hit a new quarterly record in 2026. SEMI’s Q1 figures show capital spending concentrated around leading-edge logic, DRAM, and advanced packaging as AI infrastructure keeps pulling investment towards wafer fabrication and package-level integration.
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ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.