Palomino has completed its acquisition of interconnect specialist Vega Links. The combined organisation is developing copper, MicroVCSEL, and MicroLED chipsets for connections spanning short-reach artificial-intelligence computing infrastructure.
Skyworks has cleared a significant United States antitrust timing hurdle. Reviews remain open in China and South Korea, so the proposed Qorvo combination has not completed.
Toshiba has introduced compact photorelays for dense semiconductor test systems. The devices combine 2A switching, low leakage, and substantially reduced PCB area.
Infineon’s configurable automotive eFuse brings software control to wire protection. SPOC Wire Guard supports zonal architectures, diagnostics, and fail operational systems.
Infineon’s new isolators combine compact switching, protection, and galvanic isolation. The ISSI20B family targets dense automation, test, power, and building control hardware.
NXP has integrated analogue radio and AI audio processing together. The SAF9800 combines reception, DSP, neural inference, and accelerated filtering functions.
Navitas and Magnachip will jointly manufacture higher-voltage silicon carbide devices. Ratings from 1,200V beyond 3,300V will address grid, storage, transport, and industrial conversion systems.
Texas Instruments has compressed isolated bias power into one module. The UCC33420-Q1 integrates its transformer and power stage while providing a regulated 1.5W output and 3kVRMS isolation.
ROHM’s compact evaluation board reduces buck-boost converter mounting area substantially. The five-component reference design occupies 12.87mm² while retaining low quiescent current and high efficiency.
ams OSRAM has broadened its higher-efficiency infrared emitter technology platform. IR:6 devices cover 850nm, 920nm, and 940nm applications across sensing, biometrics, medical equipment, and machine vision.