Infineon’s configurable automotive eFuse brings software control to wire protection. SPOC Wire Guard supports zonal architectures, diagnostics, and fail operational systems.
Infineon’s new isolators combine compact switching, protection, and galvanic isolation. The ISSI20B family targets dense automation, test, power, and building control hardware.
NXP has integrated analogue radio and AI audio processing together. The SAF9800 combines reception, DSP, neural inference, and accelerated filtering functions.
Navitas and Magnachip will jointly manufacture higher-voltage silicon carbide devices. Ratings from 1,200V beyond 3,300V will address grid, storage, transport, and industrial conversion systems.
Texas Instruments has compressed isolated bias power into one module. The UCC33420-Q1 integrates its transformer and power stage while providing a regulated 1.5W output and 3kVRMS isolation.
ROHM’s compact evaluation board reduces buck-boost converter mounting area substantially. The five-component reference design occupies 12.87mm² while retaining low quiescent current and high efficiency.
ams OSRAM has broadened its higher-efficiency infrared emitter technology platform. IR:6 devices cover 850nm, 920nm, and 940nm applications across sensing, biometrics, medical equipment, and machine vision.
e-peas has widened photovoltaic harvesting across sharply changing light conditions. The AEM15820 combines separate low- and high-power conversion paths within one power-management IC.
Texas Instruments has integrated high-voltage measurement into one signal chain. The TPS4141-Q1 combines precision attenuation, amplification, switching, and programmable measurement range.
Anglia has added BeRex RF semiconductors across its European portfolio. The agreement covers amplifiers, switches, gain blocks, and front-end devices.