TDK has introduced the HAL 3025 Micronas Hall-effect sensor for high-speed motor position sensing in EV, drive-by-wire, and industrial drive applications.
Wolfspeed has introduced two 3.3 kV silicon carbide power module families for AI data centres, renewable energy, storage, and high-voltage conversion infrastructure.
Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices designed to reduce PCB area and component count in compact power-path designs.
Infineon will use PCIM Europe 2026 to present silicon, SiC, and GaN technologies for AI data centres, robotics, solid-state power infrastructure, energy storage, and electromobility.
Infineon is coordinating Moore4Power, a €91m European project focused on heterogeneous integration for next-generation smart power electronics.
Vishay has introduced automotive-grade optocouplers with wider creepage and clearance distances for EV, solar inverter, and high-voltage isolation stages.
AI server growth is putting renewed pressure on high-capacitance MLCC availability, pulling passive components back into design and sourcing risk.
Melexis has introduced an 18-channel LIN RGB LED controller with an integrated 1A DC/DC converter for compact automotive lighting modules.
Analog Devices will acquire Empower Semiconductor for $1.5bn, adding integrated voltage-regulator and silicon-capacitor technologies for high-density AI compute power delivery.
Allegro MicroSystems will demonstrate current sensing and isolated gate-driver technologies at PCIM 2026, targeting SiC and GaN power designs for AI data centres and 800V EV architectures.