IQE and Tower have signed a multi-year InP epiwafer agreement. The supply deal supports silicon photonics for AI infrastructure.
TDK has introduced B25696H DC-link capacitors for SiC converter designs. The MKP film series targets high-frequency power stages across storage, traction, renewables, and drives.
Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.
Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
Qorvo has introduced its compact X-band radar front-end module package. The QPF5012 combines power, efficiency, and receive sensitivity for arrays.
Celera has acquired SiliconGate to expand analogue IC design capability. The deal adds Portuguese power-management expertise, silicon-proven IP, and design capacity for custom semiconductor development.
Cambridge GaN Devices is sampling automotive ICeGaN for inverter designs.
onsemi has launched a SiC pairing tool for power designers.
ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.