Category: News
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Lattice has introduced an AI assistant for FPGA design flows. Prompt connects engineers’ chosen models and IDEs with Radiant compilation, simulation, implementation, and device documentation.
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MACOM has launched a 3.2T optical front-end chipset platform today. Eight 448Gbps PAM-4 channels combine new receiver components with existing high-speed optical drivers.
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GlobalFoundries and Marvell are expanding SiGe manufacturing for optical interconnects. The multi-year agreement adds Burlington capacity for pluggable, near-packaged, and co-packaged optical architectures.
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Tower and NewPhotonics are shipping laser-integrated photonic engines at volume. The PH18DA devices support 800G and 1.6T links, with 6.4T near-packaged optics planned for 2027.
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Aetina has launched Jetson Thor systems for advanced robotics control. The AIE-KT78 and KT68 combine multimodal inference, high-bandwidth sensing, and deterministic EtherCAT interfaces in one edge platform.
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Europe captures little value from its growing AI infrastructure market. New research puts EU companies’ semiconductor, server, and cloud shares in single digits despite rapidly expanding demand.
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Infineon has launched a compact 120V dual-channel gate driver IC. The 2.2mm device targets dense silicon conversion stages inside next-generation AI server power architectures.
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Prodrive has begun shipping its 105-megapixel Runix machine vision camera. The MX105 combines high resolution with triple-digit frame rates for semiconductor inspection, metrology, and industrial imaging.
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Elmos secured additional Dortmund wafer capacity through 2028 and beyond. The extension supplements external foundry agreements as the automotive mixed-signal supplier strengthens manufacturing resilience.
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Besi will support Tata Electronics’ advanced semiconductor packaging expansion programme. The agreement covers equipment, process readiness, engineering capability and a technology roadmap for the $3 billion Jagiroad facility.