Category: News
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Delta’s automotive charging process has reached ASPICE Capability Level 2. The assessment covers managed development across engineering, testing, and final validation.
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Infineon flash has qualified for ASPEED’s latest server management controller. Approved vendor status gives AST2700 designers validated BMC firmware storage.
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Element14 has opened a healthcare and smart home design challenge. Selected participants will receive component kits and document complete working prototypes.
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Altus is expanding its Redditch headquarters around connected production lines. The centre will integrate SMT, through hole, backend, and component management equipment.
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BAE Systems and Lockheed Martin are advancing a modular jammer. Blizzard is being developed for electronic attack, decoy, and suppression missions.
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Advanced Energy has compressed 1.1kW PFC into half brick dimensions. The module combines 97.3% peak efficiency, PMBus control, and universal mains input.
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Toshiba has introduced compact photorelays for dense semiconductor test systems. The devices combine 2A switching, low leakage, and substantially reduced PCB area.
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NVIDIA has expanded its toolkit for AI assisted semiconductor engineering. Physics informed models, accelerated solvers, and deeper EDA integrations extend the platform across chip, package, and PCB development.
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Toray’s polymer film could substantially reduce lithium ion collector weight. The copper coated substrate is now being sampled from production equipment.
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Infineon’s configurable automotive eFuse brings software control to wire protection. SPOC Wire Guard supports zonal architectures, diagnostics, and fail operational systems.