Category: News
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Cadence Tensilica IP drives Analog Devices’ next SHARC processor architecture. The SHARC-FX core moves ADI’s automotive DSP platform to 16nm while adding higher performance, AI processing, security, memory, and connectivity capabilities.
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BAE Systems has launched compact Shadow EW airborne electronics systems. The low-SWaP family uses commercial processing silicon, software-defined functions, open architectures, and a production model intended for larger deployment volumes.
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BAE Systems will requalify its RH45 radiation-hardened ASIC design platform. The $16 million programme restores a 45nm SOI route for custom space electronics manufactured by GlobalFoundries in New York.
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Murata and Smart Eye are combining radar with cabin cameras. The concept fuses 60GHz sensing with AI-based vision for occupant monitoring, child-presence detection, and future software-defined vehicle functions.
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Intellian and Network Innovations are developing multi-band WGS flyaway terminals. The tactical systems are being designed for simultaneous military and commercial frequency access, electronic Ka-band switching, and operation across LEO, MEO, GEO, and HEO satellite networks.
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Sensirion has made its low-power SFA40 formaldehyde sensor globally available. The electrochemical device combines calibrated I²C output, 80µA typical average current consumption, and a specified operating lifetime exceeding six years.
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Infineon will sell its NOR Flash and F-RAM memory business. Winbond will pay $1.12 billion for the operation, which serves automotive, industrial, and infrastructure customers and is expected to transfer during the second half of 2027.
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Texas Instruments will centre electronica 2026 on intelligent-system engineering themes. Its Munich demonstrations will span embedded development, industrial automation, vehicle architectures, and the power electronics needed for increasingly dense AI infrastructure.
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ROHM has launched a wide-SOA MOSFET for automotive protection circuits. The 100V device targets airbags, pretensioners, and battery-disconnect pyrofuse systems.
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Micas is expanding Malaysian manufacturing for commercial co-packaged optics systems. The capacity increase covers optical integration, assembly, testing, and clean-room production.