IN Brief:
- TI will demonstrate embedded development tools combining CCStudio AI capabilities with Zephyr RTOS support across MCU, MPU, and wireless portfolios.
- Industrial demonstrations will cover real-time control, GaN motor drives, multimodal sensing, and deterministic industrial networking.
- Vehicle and AI infrastructure exhibits will extend from zonal 12V and 48V architectures to 800VDC data-centre power systems.
Texas Instruments will use electronica 2026 in Munich to demonstrate semiconductor, software and power technologies spanning embedded development, industrial automation, vehicle electronics and AI infrastructure.
The company will exhibit in Hall C4, booth 159, from 10 to 13 November. Its programme groups analogue electronics, embedded processing, sensing, communications and power conversion around increasingly distributed intelligent systems rather than treating each device category as an isolated design function.
Embedded development will form one of the main areas. TI is extending its CCStudio development environment with generative AI capabilities intended to assist code development, system configuration and debugging, while expanding Zephyr RTOS support across its microcontroller, microprocessor and wireless connectivity portfolios.
Broader Zephyr support gives developers another route for moving software between devices as embedded platforms become more dependent on reusable middleware, maintained operating systems and common application frameworks. Processor selection increasingly involves software portability and long-term ecosystem support alongside peripheral sets, memory capacity and compute performance.
TI will also demonstrate real-time microcontrollers, GaN-based motor-drive technology and multimodal sensing for industrial automation. Communications technologies including 10BASE-T1L, 10BASE-T1S and Time Sensitive Networking will form part of the same platform approach, linking sensing and control functions with deterministic industrial data transport.
That combination reflects the mixed computing requirements emerging in automated machinery. Machine vision and AI inference can require substantial processing throughput, while motion, protection and safety functions still depend on bounded response times. Dedicated real-time control therefore remains important even as more perception and optimisation workloads are added to the machine.
GaN power devices add another element to that architecture. Higher switching frequencies can reduce the size of some passive components and improve power density in motor drives and converters, although layout, thermal management, electromagnetic compatibility and gate control become correspondingly important as switching edges become faster.
Automotive demonstrations will cover processors for sensor fusion and local decision-making alongside Ethernet and FPD-Link connectivity. TI is also highlighting zonal electrical architectures using both 12V and 48V distribution as vehicle manufacturers consolidate functions that were previously spread across numerous individual electronic control units.
Zonal architectures place greater responsibility on local power conversion and networking. A zone controller may have to support sensors, actuators and communications while maintaining isolation between functions with different safety and availability requirements. Higher-voltage local distribution can also reduce current for a given power level, but requires suitable conversion stages at each load.
TI is taking the power-electronics theme beyond vehicles and factories into AI infrastructure. Its electronica programme includes solid-state transformers, GaN-based AC/DC conversion, battery management with integrated electrochemical impedance spectroscopy, and complete 800VDC architectures intended for high-density data centres.
AI compute racks are pushing facility power systems towards much higher loads, increasing pressure on conductor size, conversion efficiency and thermal management. Raising DC distribution voltage reduces current for a given power level, but the resulting architecture has to coordinate conversion, isolation, protection, monitoring and energy storage across the complete power chain.
The company is presenting that chain from grid infrastructure through conversion and storage equipment to the electronics supplying computing hardware. Solid-state transformers and high-frequency conversion offer routes to more controllable and compact power systems, but their adoption depends on efficiency, protection behaviour, semiconductor reliability and integration with existing electrical infrastructure.
TI’s conference programme will extend those themes into automotive cybersecurity, AI at the industrial edge, open-source embedded development and future grid infrastructure. Sessions include discussion of the EU Cyber Resilience Act, embedded platforms for software-defined vehicles, AI for industrial IoT and semiconductor technology beyond conventional iron-core grid equipment.
The electronica programme consequently spans several layers of system design, from development tools and real-time processors to RF links, motor drives and high-voltage power conversion. TI’s demonstrations will show how those parts are increasingly being engineered together as computing moves further into vehicles, factories and power infrastructure.
