Category: News
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Nexperia and Tata Electronics are linking Indian semiconductor manufacturing stages. The framework covers 300mm MOSFET wafer fabrication, discrete-device assembly and test, and wider technology collaboration.
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MemryX and Lenovo are expanding Saudi sovereign edge AI deployments. Their platform combines ThinkEdge servers with Cascade 100P accelerators to process video and sensor data locally across infrastructure and industrial applications.
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TMEIC has opened a Texas factory for industrial power electronics. The 280,000 sq ft Twinwood plant will manufacture UPS systems, medium-voltage drives, and related equipment for data-centre, infrastructure, and energy applications.
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ROHM has launched a wide-SOA MOSFET for automotive safety circuits. The 100V RS4P063BPHZG targets airbags, pretensioners, and battery pyrofuses requiring reliable switching during short-duration high-current and high-voltage events.
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Weltrend has launched an integrated controller for compact BLDC motors. The STL8300 combines an 8051 core, three-phase gate drive, analogue functions, protection, and closed-loop motor control in a 6 × 6mm QFN package.
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Omron is detailing microsecond counter control across its NX platform. The NX-CT performs counter-match detection within one microsecond and compensates for actuator delays in high-speed filling, inspection, dispensing, and laser processes.
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Keysight has joined Verizon’s forum for pre-standard 6G validation work. Its test and emulation expertise will support research into new spectrum, integrated sensing, AI-native networks, and eventual standards alignment.
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Ambarella has launched its first standalone edge AI accelerator chip. X7 connects to Arm or x86 hosts through PCIe Gen 3 or USB 3.2 and is sampling alongside an M.2 reference design.
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Micron has demonstrated a 512GB DDR5 module for future servers. The vertically stacked RDIMM reaches up to 9,200MT/s and could give a 24-slot dual-socket system as much as 12TB of directly attached DDR5 memory.
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Arteris has expanded its chiplet interconnect portfolio for multi-die designs. FlexGen Multi-Die extends non-coherent network-on-chip functions across UCIe links while preserving traffic control, quality of service, and design reuse.