Category: News
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Arm has added runtime evidence to AI-assisted software performance analysis. Dynamic Insights links supported profiling runs with LLM reasoning while keeping the underlying measurements available for engineers to inspect.
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Bruker has launched two detectors for faster nanoscale materials analysis. The systems combine direct-electron, X-ray, and back-scattered-electron measurements for semiconductor, thin-film, battery, and nanostructure workflows.
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FORTEC UK has introduced rugged railway edge computing into Britain. The tBOX210 combines recent Intel processors, high speed networking, removable storage, and wide range vehicle power support.
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The British Army has trialled private 5G across armoured platforms. Several live video feeds were distributed between vehicles during a dispersed command post experiment on Salisbury Plain.
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IDS has combined STARVIS 2 sensors with rugged IP69K protection. The expanded uEye FA range covers low light, washdown, dusty, and outdoor machine vision installations.
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ams OSRAM has secured strategic leadership continuity through September 2031. Aldo Kamper will oversee its concentration on optical semiconductors, digital photonics, automotive lighting, and microLED technology.
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CEA-Leti is moving three dimensional integration into future AI architectures. Fine pitch hybrid bonding is being developed alongside new approaches to power, memory, cooling, and test.
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Global silicon wafer shipments rose sharply during 2026’s second quarter. AI demand broadened beyond processors and memory as industrial and automotive semiconductor markets recovered.
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Renesas has raised DDR5 MRDIMM bandwidth to 16,000MT/s for servers. The third generation chipset targets AI and high performance computing platforms while retaining established DDR5 infrastructure.
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Innodisk has introduced 12,800MT/s DDR5 MRDIMMs for modern AI servers. Multiplexed rank access increases bandwidth without replacing the established DIMM form factor.