Category: Memory
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UD Info has introduced configurable memory cards for industrial systems. The range combines firmware customisation, fixed bills of materials, health monitoring, and wide-temperature pSLC options, with samples available during August.
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Renesas has raised DDR5 MRDIMM bandwidth to 16,000MT/s for servers. The third generation chipset targets AI and high performance computing platforms while retaining established DDR5 infrastructure.
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Innodisk has introduced 12,800MT/s DDR5 MRDIMMs for modern AI servers. Multiplexed rank access increases bandwidth without replacing the established DIMM form factor.
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Infineon flash has qualified for ASPEED’s latest server management controller. Approved vendor status gives AST2700 designers validated BMC firmware storage.
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SK hynix has begun shipping HBM4 during another record quarter. HBM4E samples, sixth generation DRAM, and 321 layer NAND extend its AI memory roadmap.
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Astute has added UTA modules as memory shortages spread upstream. The agreement gives embedded developers additional cellular and positioning options during constrained supply.
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Samsung and Broadcom are aligning memory, foundry, and packaging roadmaps. Their expanded agreement joins HBM supply with advanced-node manufacturing and heterogeneous integration.
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Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.
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GigaDevice has entered the industrial EEPROM market with GD24CL devices. Endurance reaches four million write cycles, with retention specified at 100 years.
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Exascend has extended rugged storage into industrial PCIe 5.0 systems. New enterprise and embedded options combine high capacity, power-loss protection, wide-temperature operation, and endurance-focused pSLC configurations.