SK hynix has mapped optical interconnect scaling beyond current HBM. The roadmap targets bandwidth, energy, and latency bottlenecks across next-generation AI compute and memory systems.
Prodigy has launched a UFS 5.0 protocol validation platform commercially. PGY-UFS5-EX-PA supports 46.64Gbps per lane, PAM4 acquisition, continuous capture, decoding, packet triggering, and error analysis.
Micron has launched a decade-long programme for advanced semiconductor research. The planned $10bn investment spans future memory, compute architectures, advanced packaging, and manufacturing technology.
Sandisk is reshaping NAND development around AI storage requirements now. Its roadmap combines bonded CMOS, denser QLC flash, HBF, and longer-term customer capacity agreements.
Enterprise SSDs now consume nearly half of global NAND shipments. Counterpoint says AI inference lifted their share to 48% of NAND bits in Q2, while YMTC entered the shipment top three.
Altera has expanded Agilex memory support through Quartus 26.1.1 software. The update adds DDR5-6400 and LPDDR5-6400 on Agilex 7 M-Series devices, alongside broader low-power memory options elsewhere in the portfolio.
Researchers have demonstrated a 28nm SRAM compute-in-memory macro for edge-AI. The design targets signed arithmetic, routing congestion, and switching overhead while supporting INT8 and BF16 computation.
TrendForce expects DRAM constraints to reshape future HBM configurations significantly. Accelerator developers are evaluating lower-capacity options as supply and validation pressures persist.
Samsung has presented vertical memory concepts for future AI systems. zHBM places memory above accelerators, while zNAND-O targets dense, low-latency edge storage.