Category: Memory
-
Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.
-
GigaDevice has entered the industrial EEPROM market with GD24CL devices. Endurance reaches four million write cycles, with retention specified at 100 years.
-
Exascend has extended rugged storage into industrial PCIe 5.0 systems. New enterprise and embedded options combine high capacity, power-loss protection, wide-temperature operation, and endurance-focused pSLC configurations.
-
SEMI expects semiconductor equipment sales to maintain growth through 2028. AI investment is lifting wafer fabrication, memory, test, assembly, and packaging.
-
ZeroPoint has brought lossless compression directly into silicon memory paths. ZeroStream targets bandwidth-bound AI accelerators, CPUs, and networking SoCs.
-
Samsung has begun mass production of its PCIe 6.0 SSD. The PM1763 combines ninth-generation V-NAND, a 4nm controller, high throughput, liquid-cooling optimisation, and hardware security.
-
ASML raised its 2026 sales forecast as AI investment accelerates. The revision reflects stronger demand across advanced logic, memory, and lithography capacity.
-
Apacer has added hardware power-loss protection to industrial SSD designs. CorePower preserves cached information during sudden supply failure, reducing corruption risk in edge-AI, manufacturing, transport, and healthcare systems.
-
AI demand is reshaping memory allocation across semiconductor markets globally. SEMI has warned that intervention in memory markets could worsen supply pressure as HBM pulls capacity from conventional DRAM.
-
Secure storage and board-level protection are converging around AI infrastructure. Swissbit and Nexperia are working together on high-reliability platforms for cloud, server, edge, and industrial systems.