Category: Memory
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EnSilica joins the CHERI Alliance to harden custom ASICs today. The mixed-signal supplier says it will use CHERI capability-based hardware techniques to strengthen memory safety for automotive and industrial silicon.
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SK hynix is accelerating capacity as HBM demand tightens again. The company is expanding near-term output via M15X and progressing its Yongin cluster plan, with the first fab scheduled for completion in May 2027 and designed to produce next-generation DRAM, including HBM.