Category: News
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TDK has introduced B25696H DC-link capacitors for SiC converter designs. The MKP film series targets high-frequency power stages across storage, traction, renewables, and drives.
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Lantronix has partnered with Cherry and White on rapid connectivity. The platform combines rugged industrial gateways with field-deployable Wi-Fi for critical sites.
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.
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NeoCortec is bringing NeoMesh into Endrich’s e-IoT platform for sensors. The wireless mesh layer supports low-power industrial nodes, gateways, and monitoring systems without new cabling.
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ROHM has introduced TSC3PAK for top-side-cooled SiC MOSFET power packages. The package combines surface-mount assembly with insulation and thermal performance for high-voltage power conversion.
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Thales will supply 60 GO12 radar systems to Germany’s Bundeswehr. The order adds mobile 360-degree ground surveillance for drone and vehicle detection in adverse weather.
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Our latest issue examines resilient electronics supply chains under pressure. It spans medical technology, AI-ready networks, component availability, data integrity, and connected-device compliance.
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Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
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GF and Qualinx have completed a European semiconductor manufacturing flow. The Dresden-based process keeps security-critical GNSS chip production inside Europe.