Category: News
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Memory-safe languages correlate with lower embedded development and maintenance costs. A VDC study compares language decisions across safety-critical and real-time engineering programmes.
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Samsung and Broadcom are aligning memory, foundry, and packaging roadmaps. Their expanded agreement joins HBM supply with advanced-node manufacturing and heterogeneous integration.
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AMD has combined heterogeneous processing within a production-ready robotics platform. CPU, GPU, NPU, and programmable-logic resources support perception, planning, inference, control, and industrial connectivity.
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Siemens is adding deterministic verification to long-running agentic EDA workflows. The system connects generative automation with established simulation, implementation, test, and sign-off engines for semiconductor and PCB development.
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LITILIT is expanding femtosecond-laser production for PFAS-free surface processing applications. Micro- and nanoscale texturing can replace selected fluorinated coatings and chemical treatments.
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DigiKey and Machinechat have combined sensors, hardware, and local software. The rapid engineering kit turns environmental measurements into dashboards, storage, and alerts.
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Mouser now stocks TI’s compact UCC33420-Q1 isolated DC-DC power module. The 1.5W device integrates its planar transformer and switching stage.
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BAE Systems is funding new postgraduate UK RF engineering training. NMITE’s master’s programme combines wireless systems teaching with industrial projects and mentoring.
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Hitachi Energy will build Elmed’s two international HVDC converter stations. The €770 million contract covers valves, transformers, switchgear, digital control, and commissioning.
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Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.