Category: News
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Schurter has introduced a low-profile switch for fixed hardware configuration. The DMSD family combines standard 2.54mm spacing with automated assembly compatibility and an industrial operating-temperature range.
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LUCI and TALQ are aligning urban lighting with interoperable controls. Their partnership connects municipal experience with an open protocol for managing outdoor lighting and other smart-city systems.
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PLATON combines plenoptic imaging and SPAD sensing for particle tracking. The prototype reconstructs three-dimensional events inside an unsegmented scintillator, potentially reducing the component count required by conventional detector architectures.
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Intel and Fortinet will co-develop Fortinet’s sixth-generation security processor silicon. SP6 will combine custom cybersecurity architecture with Intel design, packaging, manufacturing, and semiconductor intellectual property.
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Belgian software companies will integrate mission systems with MQ-9B aircraft. The programme covers C4ISR, geospatial displays, sensor processing, automated exploitation, and interfaces connecting European capabilities with the remotely piloted platform.
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Congatec has launched a COM-HPC module for demanding edge AI. The conga-HPC/cRX1 combines CPU, GPU, and NPU computing with industrial-temperature operation, high-bandwidth memory, and extensive expansion interfaces.
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Vision Engineering has launched an autofocus microscope for production inspection. PicoZoom combines motorised optical zoom, focus stacking, controlled illumination, measurement, annotation, and reporting within a compact bench-top system.
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Altus added higher-power laser depaneling equipment across Britain and Ireland. LPKF’s 90W CuttingMaster 3290 targets faster separation of thick FR4, ceramic, flex, and rigid-flex assemblies with reduced mechanical stress.
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Kigen has opened practical SGP.32 evaluation through an eSIM kit. Certified eSIMs, remote-provisioning platforms, device software, and activation-ready connectivity profiles allow teams to test fleet operations before deployment.
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Farnell has expanded edge-AI access through a global Hailo partnership. The agreement adds processors, accelerator modules, and development systems for industrial vision, robotics, transport, and connected infrastructure.