Power Integrations has introduced compact 800VDC auxiliary PSU designs. The 15W and 35W flyback references use 1700V PowiGaN InnoMux-2 ICs for high-voltage AI data-centre architectures based on NVIDIA Kyber.
Atomera is targeting RF GaN-on-silicon performance with MST processing. The approach uses an oxygen-modified silicon layer to reduce parasitic channel charge, aiming to narrow the performance gap between lower-cost silicon substrates and established RF GaN-on-SiC platforms.
Microchip’s Armenian engineering team has gained advanced FPGA authorisation. The US export licence covers controlled semiconductor technology and related high-performance hardware, allowing approved engineers to work on selected FPGA programmes under defined compliance controls.
SemiQ will show expanded SiC power modules at PCIM Europe. The portfolio includes QSiC Dual3 devices, AlN substrate options, pre-applied thermal interface material, and high-current packages for AI infrastructure, EV charging, storage, solar, and industrial drives.
Toshiba has introduced automotive MOSFETs for compact power switching designs. The 40V N-channel devices use SOP Advance(EWF) packaging to improve current capability, reduce on-resistance, and support vehicle systems including load switches, relays, inverters, and motor drives.
Marktech has expanded its COTS and custom photodetector and LED capabilities with transfer-moulded packaging technology. The platform targets defence and aerospace sensing, targeting, and optical alignment systems requiring compact, rugged, and repeatable optoelectronic packages.