Category: News
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Astute Group has added UK stock of ATS thermal management products for NVIDIA Jetson modules. The range covers active heatsinks, passive options, and thermal transfer plates for robotics, edge computing, smart monitoring, and physical AI systems.
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Infineon has integrated its OPTIGA TPM SLB 9672 with NVIDIA Jetson Thor. The hardware root of trust secures keys, verifies software integrity, and supports post-quantum update protection for physical AI systems and robot fleets.
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ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
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JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.
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Bull and Foxconn will manufacture AI and cloud infrastructure across France and the Czech Republic. The partnership targets AI factories, neo-cloud providers, enterprises, and research institutions, with an initial investment expected to exceed €120m.
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Tessalia will produce advanced SiP components in France. The Foxconn, Radiall, and Thales joint venture targets aerospace, telecoms, automotive, and medical applications, with production planned from 2029 and annual output above 50 million components by 2033.
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Eatron and NEXTY Electronics are moving battery-monitoring projects into commercial deployment. Their platform combines AI and physics-based models for battery health, safety diagnostics, and lifecycle prediction.
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QPT has opened customer demonstrations of MicroDyno. The GaN motor-drive platform now adds field-oriented control, dynamic cogging correction, digital-twin modelling, and edge-AI fault detection.
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Longsys has introduced AIDIMM and AILPBGA memory products. The devices target local AI inference, compact embedded systems, and edge compute platforms under memory, bandwidth, power, and thermal constraints.
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CSG has won two NATO customer contracts for fuzes. The orders cover mechanical and electronic fuzes for large-calibre ammunition, with electronic fuze production involving Fuchs Electronics Europe in Slovakia.