Category: News
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Nordic demonstrates faster Bluetooth radio technology using prototype silicon hardware. Its preliminary 2 MB file transfer averaged 3.8 Mbps on the fastest HDT mode, with final standardisation still pending.
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AIXTRON’s semiconductor equipment orders climbed sharply during the third quarter. Optical communication demand leads the increase, with new GaN and SiC capacity orders indicating a more tentative recovery in power electronics.
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Rehm combines convection, condensation and vacuum in complex PCB soldering. Its Vision RCC system integrates convection, vapour-phase soldering and vacuum processing, with a stated maximum assembly mass of 25 kg.
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Kontron and NOFFZ automate production testing of German 5G modules. Parallel RF and functional checks, robotic handling and laser marking support traceability at the German production site.
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ifm has introduced its LDH313 sensor for dew-point monitoring applications. The instrument measures compressed-air pressure dew point from −20°C to +20°C, supports pressures up to 50 bar and provides IO-Link and 4–20mA analogue output.
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UbiQD has secured funding for a fibre-coupled single-photon source prototype. The $200,000 New Mexico award supports optical equipment and quantum-dot characterisation, while room-temperature operation and reliable photon delivery remain development targets.
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ASMPT recorded unprecedented orders for semiconductor and electronics manufacturing equipment. Third-quarter bookings reached HK$8.85bn, up 137.9% year on year, with demand for thermocompression bonding, photonics and surface-mount assembly systems.
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EPC has launched two GaN evaluation boards for motor control. The EPC91124 and EPC91125 support 18–80V operation and pulse-width modulation up to 100kHz, with integrated current sensing, voltage monitoring and external controller interfaces.
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SemiQ has introduced fourth-generation silicon carbide MOSFETs for power conversion. Its 750V and 1,200V devices offer specified on-resistance values of 9mΩ and 11mΩ respectively, with changes to cell geometry intended to reduce conduction and switching losses.
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Seoul Viosys has started producing phosphor-free white microLED semiconductor devices. Its WICOP 3 architecture produces white emission from chips measuring 25 × 10µm, with the manufacturer reporting 0.015 lumens of output and luminous efficacy approaching 100lm/W.