Category: News
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NXP’s i.MX 95 processors are now entering wider distribution channels. The platform combines heterogeneous Arm processing, neural acceleration, security, and high-speed industrial connectivity.
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Researchers have demonstrated efficient perovskite LEDs using vacuum deposition techniques. Controlled crystallisation produced 21.9% efficiency alongside narrow, high-purity light emission.
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IQE has raised revenue guidance as photonics demand accelerates sharply. Indium-phosphide wafers for AI data centres are leading the recovery.
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Microsoft will deploy AMD’s Helios rack architecture across Azure infrastructure. New processor-led virtual machines will support AI pipelines, EDA, and technical computing.
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Keysight is bringing guided structural simulation into electronics development workflows. Multiphysics begins with drop, shock, and vibration analysis before prototyping.
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SEMI expects semiconductor equipment sales to maintain growth through 2028. AI investment is lifting wafer fabrication, memory, test, assembly, and packaging.
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Speedata has selected FlexNoC interconnect IP for its Callisto processor. The analytics accelerator moves Spark, ETL, and AI preparation into silicon.
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Murrelektronik has expanded decentralised connectivity across modular industrial automation architectures. The portfolio combines IO-Link, functional safety, field power, and industrial networking.
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Honeywell has introduced European-built navigation for contested military vehicle operations. The iTALIN 550 combines inertial sensing, corrected positioning, and electronic protection.
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ABB is expanding direct-current conversion through its Advantics acquisition agreement. The French specialist adds silicon-carbide hardware, firmware, and controls for demanding power infrastructure.