Infineon is embedding silicon carbide devices directly within inverter boards. Its ENDOPACK concept targets lower parasitics and a different manufacturing route for automotive power stages.
Infineon will substantially expand European gallium nitride production at Villach. The investment runs through 2034, with production expected to begin in late 2027 and €319m in European Chips Act support.
IQE and Atomera have agreed joint RF semiconductor development work. The companies will optimise gallium nitride epitaxy on silicon incorporating Mears Silicon Technology, with wafer samples intended for future customer evaluation.
Seika details stencil measurement research at Rochester Institute of Technology. Its operating Sawa T100 inspection system supports comparative testing of stencil geometry and repeatability for ultra-high-density electronics assembly.
Rambus is adopting ChipAgents across its semiconductor design workflows companywide. The collaboration covers chip and silicon IP development, verification, and AI-assisted integration in existing electronic design automation environments.
Ventec has opened its first Southeast Asian PCB materials factory. The Thailand operation will progressively expand production of prepreg, bond-ply and laminates, alongside a separate US$50 million investment in Kunshan.