Category: News
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Anritsu and YOTASYS are advancing AI-enabled RF spectrum monitoring systems. Their collaboration combines analyser hardware, GPU processing, and machine-learning software for signal classification, anomaly detection, interference analysis, and distributed monitoring.
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ENISA has warned critical-sector cyber maturity remains uneven across Europe. Its NIS360 report shows improvement under NIS2, while health, rail, space, public administration, and water still sit in higher-risk territory.
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Rambus has introduced a DDR5 9600 client memory module chipset for CUDIMM, CQDIMM, and CSODIMM designs in future AI PCs, workstations, and notebooks.
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Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.
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P&N Europe is offering compact thermoelectric coolers for optical transceiver assemblies, targeting laser temperature stability in high-speed data centre, AI, telecom, and coherent optical links.
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ROHM has released a web-based PLECS simulator that allows power electronics designers to evaluate losses, temperature rise, waveforms, and device selection during early circuit development.
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xTool has launched the M2 Color Craft Laser in the UK, combining CMYK printing, laser cutting, engraving, dual cameras, and automated alignment in a desktop fabrication system.
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Qorvo has introduced RF switches spanning 50MHz to 10GHz, targeting multi-band 5G radios, industrial systems, drones, and test applications.
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AMD has expanded its Versal Prime Series Gen 2 adaptive SoC family with smaller devices aimed at embedded systems requiring high scalar compute in constrained footprints.
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Mouser is now stocking NXP’s i.MX RT1180 crossover MCUs, combining dual-core Arm processing, TSN switching, industrial Ethernet protocol support, and embedded security.