Category: News
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Automotive developers report substantial effort spent integrating foundational software systems. A QNX-commissioned survey of 1,100 developers finds that integration absorbs an average 35% of their reported working time.
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Glasgow researchers will lead a new UK electronic materials network. The £1.4 million RaRE initiative connects more than 50 partners working on semiconductor processing, electromagnetic materials and sustainable electronics.
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CORE-emt is building larger facilities for Nordic electronics manufacturing customers. Its new Aars headquarters will house equipment demonstrations, practical training and service support, with relocation targeted for March 2027.
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CTX has expanded thermal interface options for electronic cooling assemblies. Its cut-to-size pads, gap fillers and graphite foils can be supplied separately or preassembled with heatsinks.
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TASKING has unified development tools for NXP automotive microcontroller software. The S32K5 environment combines compilation, debugging and verification, with AUTOSAR driver support and safety-related tool qualification.
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Neways will package Melexis sensors for liquid cooling and refrigeration. The partners have developed a compact housing for Triphibian pressure devices used in electric vehicles and data centres.
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Cadence has opened sovereign infrastructure for European semiconductor design workloads. Its Munich OnCloud service is available now, with further NVIDIA computing systems and digital twin instances planned.
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Besi records substantial order growth for advanced semiconductor assembly equipment. Third-quarter orders reached €342.6 million, with hybrid bonding, computing and photonics contributing to the increase.
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ST has introduced four combined sensors for automotive safety applications. The devices integrate angular-rate and acceleration measurement with SafeSPI communications and internal diagnostics, and all four are in production.
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SiPearl and Egis will develop a modular server processor platform. Mobius100 combines Arm Neoverse V3 technology and UCIe chiplet links, providing the architectural basis for SiPearl’s Rhea2 programme.