Glasgow leads £1.4m electronic materials network

Glasgow leads £1.4m electronic materials network

Glasgow researchers will lead a new UK electronic materials network. The £1.4 million RaRE initiative connects more than 50 partners working on semiconductor processing, electromagnetic materials and sustainable electronics.


IN Brief:

  • The University of Glasgow will coordinate the £1.4 million RaRE Materials Network Plus, bringing together more than 50 partners.
  • The research remit includes emerging semiconductors, advanced connectivity, heterogeneous integration and sustainable electronics.
  • Partner support exceeds £1 million, separate from the network award within a broader £12.8 million programme.

The University of Glasgow will lead a £1.4 million network connecting research into electronic materials with semiconductor engineering, product design and manufacturing. More than 50 organisations from academia, industry and government are involved in the initiative, which is intended to improve the transfer of materials research into practical electronic systems.

The Responsible and Resilient Electronic and Electromagnetic Materials Network Plus, known as RaRE, brings together participants who have committed more than £1 million in partner support in addition to the network award. RaRE is one of four national networks supported alongside nine partnerships through a broader £12.8 million funding programme, rather than the sole beneficiary of that total.

The National Materials Innovation Programme is funded by the UK government and delivered through Innovate UK and the Engineering and Physical Sciences Research Council. Professor Mahmoud Wagih is principal investigator at Glasgow, with co-investigators from Oxford, Southampton and Loughborough contributing complementary expertise.

The network is addressing the separation between research into promising material properties and the engineering needed to manufacture reliable electronic devices. A semiconductor may show favourable electrical behaviour in a laboratory structure but require substantial further development before it can be fabricated consistently alongside established circuit materials.

Process temperature, contamination, layer thickness and the interfaces between materials can change the behaviour of a device. Researchers consequently have to assess electrical characteristics after deposition, patterning and contact formation, not only in a small sample produced under controlled experimental conditions.

RaRE will connect projects involving emerging semiconductors made using wafer-scale and large-area manufacturing processes. Wafer-scale production requires repeatable processing across an entire substrate, where variations in material thickness or defect density can affect device yield. Large-area processing introduces different constraints concerning coating uniformity, dimensional accuracy and substrate stability.

Southampton researchers are contributing work on two-dimensional semiconductors, organic materials, solution-processable metal oxides and quantum-dot nanocrystals. Each offers different potential electronic or optoelectronic characteristics, but contact resistance, environmental stability and compatibility with other fabrication steps can limit practical integration.

A semiconductor contact must allow current to enter and leave an active material without unacceptable losses. An interface that performs adequately in an isolated test structure may behave differently when placed within an integrated circuit with other layers, wiring and packaging materials. Those interactions are part of the network’s intended research scope.

Electromagnetic materials form another research area. Antennas, filters and wireless components depend on dielectric constant, loss, conductivity and geometry, particularly as frequencies rise. Manufacturing changes that alter a material’s thickness or composition can shift impedance and resonance, affecting how the finished device transmits or receives signals.

Loughborough will contribute capabilities connecting electromagnetic materials with communications, defence and other engineering applications. The partnership seeks to bring together people who understand material chemistry with specialists able to test how those materials behave in actual electronic layouts.

Heterogeneous integration adds a further set of constraints. Semiconductor packages can combine materials and devices with different electrical and mechanical properties, but the interfaces must withstand manufacturing temperatures and subsequent operation. Differences in thermal expansion can place stress on interconnects even where the electrical design is sound.

Research into sustainable electronics includes plant-derived substrates and degradable materials for circuit structures. A substrate proposed as an alternative to conventional board materials must still provide suitable electrical insulation, dimensional stability and resistance to the temperatures encountered during component assembly.

The environmental performance of a new substrate also depends on manufacturing energy, service life, repair and end-of-life processing. Oxford’s participation will connect material development with circular product design and lifecycle evaluation rather than treating a biodegradable ingredient as proof of lower total impact.

The programme has a supply chain dimension because UK electronics producers depend on internationally sourced semiconductor materials, components and specialist manufacturing processes. Stronger domestic research expertise could create options for future supply, but it does not immediately establish qualified factories or substitutes for existing commercial materials.

RaRE will also support skills development and collaboration between organisations working at different stages of electronic product development. Involving manufacturers during earlier research may reveal constraints in processing, reliability and inspection before a proposed material reaches an expensive qualification stage.

The universities have not named a commercial semiconductor device, pilot production line or manufacturing contract arising from the new network. Initial activity will centre on establishing research links, developing proposals and evaluating which material technologies warrant further engineering and scale-up.

Subsequent programmes will need to demonstrate repeatable fabrication, component performance and integration with other electronic structures before industrial adoption can be assessed. The funding establishes a framework for that work; it is not a commitment to particular production yields, products or domestic manufacturing capacity.


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