Category: News
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Nokia is deploying Cadence agents to accelerate electronic system design. The on-premises AuraStack and Millennium M2000 deployment has delivered a company-reported fivefold improvement in selected design and analysis workflows.
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STMicroelectronics introduces integrated MasterGaN7 devices for compact power conversion applications. Each device combines a 650V half-bridge and gate driver, supports switching up to 2MHz, and is already in volume production.
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October’s IN Electronics examines where physical AI meets engineering limits. The new issue traces the decisions behind connected products, edge processing, and hardware that must perform under real operating conditions.
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KEYENCE has acquired France’s TraceParts engineering component data platform business. The Japanese automation group gains a catalogue serving more than 6.5 million registered users, while TraceParts retains its brand, commercial arrangements and responsibility for the data it manages.
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TDK has introduced two thermistor assemblies for high voltage equipment. The M704 supports up to 4,000 V AC, while the M705 offers metal-tag mounting and a higher maximum operating temperature.
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Melexis has introduced programmable Hall sensing for remote vehicle endpoints. The MLX92342 reports sensor states and faults over two wires, with an optional boardless package.
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Photon Bridge has secured fresh investment for semiconductor laser development. The €10 million round supports customer qualification, with samples planned in 2027 and volume manufacturing preparations from 2028.
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Germany’s QSolid consortium is testing a larger quantum computer prototype. Its 10-qubit demonstrator is already accessible, while the 30-qubit system remains under evaluation.
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Innodisk has packaged four cameras for embedded vision system development. The GMSL2 starter kit includes fixed-focus modules, a capture card, one-metre FAKRA cables, and driver source code for a supported NVIDIA platform.
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Murata has developed a smaller thermistor for dense electronic assemblies. The NCU01 occupies approximately 60% less mounting area than its predecessor while retaining ±1% resistance and B-constant tolerances for temperature monitoring.