Category: News
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Pickering will present modular RF and microwave switching systems at IMS 2026, including PXI/PXIe modules up to 110GHz.
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ATGBICS has developed a fly-by-fibre transceiver approach for defence drones operating in environments where wireless control links are degraded or denied.
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AI server growth is putting renewed pressure on high-capacitance MLCC availability, pulling passive components back into design and sourcing risk.
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Melexis has introduced an 18-channel LIN RGB LED controller with an integrated 1A DC/DC converter for compact automotive lighting modules.
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HighTec and SiFive are combining qualified compiler tooling with RISC-V processor IP to support safer automotive and industrial software development.
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Innodisk has introduced a 10GbE LAN module portfolio for edge AI systems, combining M.2 and PCIe form factors with Intel Ethernet controllers, DPDK, PTP, SR-IOV, and wide-temperature options.
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SEMI FlexTech has opened a 2026 request for proposals covering flexible hybrid electronics, bonding reliability, 2D materials, and flexible energy storage, with Army Research Laboratory funding.
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Analog Devices will acquire Empower Semiconductor for $1.5bn, adding integrated voltage-regulator and silicon-capacitor technologies for high-density AI compute power delivery.
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TDK will use PCIM Europe 2026 to show passive components, sensors, contactors, µPOL converters, and power-stage technologies for AI data centres, electrification, industrial drives, and EV infrastructure.
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Variscite is preparing the VAR-SMARC-MX95 system-on-module, combining NXP i.MX 95 processing, edge AI acceleration, real-time coprocessors, safety architecture, and SMARC compatibility.