Category: News
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Quantinuum reports improved logical memory protection on its Helios computer. Its distance-seven colour-code result produced 99.9995% fidelity per correction cycle; this is not an end-to-end algorithm success rate.
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Sony has developed a miniature image sensor for disposable endoscopes. The IMX742 provides 720 × 720 pixels, supports up to 60 fps, and has transmitted digital video over five metres using AWG44 cable in Sony’s evaluation environment.
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Renesas has introduced two faster industrial microcontrollers with embedded MRAM. The RX74M and RX74N use 22 nm manufacturing, operate at up to 600 MHz, and add security features; RX74M also integrates dedicated EtherCAT and TSN-capable Ethernet hardware.
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Impulse Embedded has relaunched configurable computing systems built around Advantech. VELA covers industrial PCs, performance systems, GPU computers, and servers, with UK configuration, software installation, and testing before delivery.
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TDK has introduced compact Y1 capacitors for interference suppression applications. The B3201 series supports 500 V AC operation and temperatures up to 125°C, subject to voltage derating and a defined elevated-temperature duration limit.
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GÖPEL has added ASA-Motion Link support to its Video Dragon. The modular test platform captures and generates video streams for automotive cameras and displays, with standalone and computer-integrated hardware options.
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Zuken has extended automation throughout its CR-8000 PCB design platform. The 2026 release introduces schematic routing, placement analysis, locally managed design reuse, EMC checks, and improved routing controls for complex electronics.
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Socionext is applying Cadence agents to advanced semiconductor physical design. The companies are integrating proprietary engineering knowledge with InnoStack workflows for a large 3 nm SoC; the projected fivefold productivity gain remains unverified.
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Siemens is automating electrothermal design across advanced semiconductor packaging workflows. An NVIDIA-supported agent coordinates seven EDA tools and nine stages; Siemens reports separate benchmark reductions in engineering effort and setup time.
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Siemens and NVIDIA are moving PCB inspection preparation into simulation. The workflow uses digital twins and synthetic defect images to develop automated optical inspection programmes before production, with a demonstration at Siemens’ Erlangen electronics factory.