Category: News
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Melexis has introduced programmable Hall sensing for remote vehicle endpoints. The MLX92342 reports sensor states and faults over two wires, with an optional boardless package.
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Photon Bridge has secured fresh investment for semiconductor laser development. The €10 million round supports customer qualification, with samples planned in 2027 and volume manufacturing preparations from 2028.
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Germany’s QSolid consortium is testing a larger quantum computer prototype. Its 10-qubit demonstrator is already accessible, while the 30-qubit system remains under evaluation.
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Innodisk has packaged four cameras for embedded vision system development. The GMSL2 starter kit includes fixed-focus modules, a capture card, one-metre FAKRA cables, and driver source code for a supported NVIDIA platform.
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Murata has developed a smaller thermistor for dense electronic assemblies. The NCU01 occupies approximately 60% less mounting area than its predecessor while retaining ±1% resistance and B-constant tolerances for temperature monitoring.
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Micron will finance expanded semiconductor materials processing in New York. Its agreement with Indium Corporation supports refining and high-purity manufacturing at the company’s Rome facility, alongside a planned long-term supply arrangement for advanced memory production.
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The Advanced Photonics Coalition has published five optical manufacturing documents. They cover co-packaged optics, silicon photonics testing and fabrication, and four-core fibre interfaces, with the aim of improving component interoperability and manufacturing repeatability.
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Synaptics has introduced three processors combining embedded control and AI. The Astra SR200 family pairs Arm Cortex-M85 and Cortex-M52 cores with Coral neural acceleration and integrated memory for multimodal processing at the edge.
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Samsung Electro-Mechanics has secured a substrate supply agreement with NVIDIA. Existing Korean ABF capacity will support initial deliveries, while planned facilities and upgrades at Sejong and Busan will expand manufacturing for AI processors and networking chips.
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UMC and AP Memory are developing advanced silicon capacitor technology. Their partnership combines deep trench manufacturing and S-SiCap designs for AI processor packages; Gen2D tape-out and initial functional validation are complete, with package-level reliability testing next.