Category: News
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IC-Link by imec has joined TSMC’s 3DFabric Alliance, strengthening access to 2.5D and 3D packaging technologies for advanced ASIC, photonics, AI, HPC, mobile, automotive, and telecom designs.
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Microchip has launched a vacuum-sealed oscillator for critical timing applications.
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TAIYO YUDEN has expanded its compact metal power inductor range.
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Red Cat is linking air and maritime autonomy for SOF missions.
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Doodle Labs will showcase resilient networking for autonomous defence systems.
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L3Harris will highlight counter-UAS electronics for layered defence systems.
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Rohde & Schwarz has added new tools for wide-bandgap validation.
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Stackpole has released wide-termination resistors for high-reliability electronics.
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TrendForce data points to sharper mobile DRAM cost pressure ahead.
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MaxLinear has launched Trinity for cloud-managed 5G wireless backhaul systems.