IonQ has moved Superion 256 towards semiconductor-based quantum manufacturing scale. Integrated 256-qubit QPUs are fabricated, with first ions trapped in prototypes.
French researchers have combined memristors and SMTJs for hardware optimisation. The architecture uses device-level randomness to implement intrinsic annealing during its search.
SEMI wants Chips Act 2.0 support across Europe’s semiconductor chain. Nine proposals address investment, operating costs, governance, resilience, and workforce capacity.
Imec has pushed CAR resists to 22nm-pitch High-NA EUV patterning. The single-exposure work also reaches 28nm-spaced vias for A14/A10 logic.
MegaChips will embed proteanTecs telemetry into next-generation ASIC and LSI. The collaboration targets power, performance, reliability, and lifecycle visibility from development through deployment.
GIGALIGHT has completed a shippable 1.6T near-package optical engineering sample. The socket-based OIF design exposes mechanical and manufacturing barriers that still separate NPO demonstrations from volume deployment.
Global semiconductor sales reached $146.8 billion in July, SIA reports. The market rose 6.4% month on month, extending sequential growth to a seventeenth consecutive period.
IQE revenue climbed 43% as compound semiconductor demand strengthened globally. Photonics led growth, while the group plans to convert tooling for additional indium phosphide capacity.
Acconeer secured another automotive production order for its A121 sensor. The $120,000 order from a Japanese distributor is scheduled for first-quarter 2027 delivery.
Infineon has introduced dual-phase power stages for dense AI accelerators. The 6mm devices support 300A peak current, vertical power delivery, and liquid-cooling integration.