Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.
Siemens has introduced Simcenter PhysicsAI as an add-on to Simcenter STAR-CCM+, using geometric deep learning to accelerate CFD-based design exploration.
Xaar will show battery coating applications for its industrial inkjet technology at The Battery Show Europe, targeting digital deposition for EV and energy storage cells.
Legrand UK & Ireland has opened a 43,000 sq ft electronics manufacturing facility in Cramlington, supporting CP Electronics lighting controls and Legrand Care production.
Norwegian war-risk insurer DNK has launched an A-PNT programme to help vessels maintain positioning and timing integrity under GNSS interference.
Pickering will present modular RF and microwave switching systems at IMS 2026, including PXI/PXIe modules up to 110GHz.
Vision Engineering Group will show metrology, inspection, digital 3D imaging, and contract manufacturing capabilities at Smart Factory Expo 2026, targeting quality control, traceability, rework, and precision manufacturing workflows.
Anglia has added Same Sky components across its European platform.