Category: Electronics
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Siemens is automating electrothermal design across advanced semiconductor packaging workflows. An NVIDIA-supported agent coordinates seven EDA tools and nine stages; Siemens reports separate benchmark reductions in engineering effort and setup time.
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Infineon and NVIDIA are advancing conversion for higher voltage racks. New GaN intermediate bus designs target 800 VDC distribution, with conversion to 50 V, 12 V, and 6 V ahead of processor power stages.
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Electroninks and IDS report faster production of multilayer printed heaters. A three-week manufacturing run produced more than 100 devices within a specified electrical tolerance, with the companies reporting a 73% reduction in processing time per unit.
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Rohde & Schwarz has confirmed fourteen sessions for Silverstone’s forum. The 24 November programme covers measurement methods, reverberation chambers, interference troubleshooting and AI-assisted analysis across three parallel technical streams.
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Astute confirms its electronica demonstration programme across embedded electronics technologies. The Munich stand will feature edge AI, voice interfaces, System-in-Package devices, secure processors and industrial sensing from its technology partners.
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Preferred Networks and Tenstorrent develop new photonic AI processor architectures. A five-year NEDO programme will combine optical interconnects, advanced packaging, stacked memory and secure CPU chiplets, with research contributions from Japanese universities and laboratories.
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Neurophos and MIT are collaborating on algorithms for photonic processors. The programme combines Julia Lab numerical methods with optical processing hardware designed for matrix operations, targeting improvements in computational performance and energy efficiency.
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SEMI forecasts silicon wafer shipments rising sharply worldwide during 2026. Its latest projection anticipates 11.8% growth to 14,420 million square inches this year, followed by successive annual shipment records through 2029.
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ASMPT has developed placement hardware for heavy AI processor packages. Its SOLO head handles BGAs measuring up to 240 × 240 mm and initially weighing more than 2 kg, with an increase towards 5 kg planned.
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Navitas expands 2,300 V SiC modules with new connection options. The 21 October announcement adds higher-current press-fit variants and pre-applied thermal interface material to an 8 mΩ module already listed for sampling in April.