Sivers has received its first production orders for LiDAR components. Deliveries of distributed-feedback lasers and optical amplifiers are scheduled to begin in the fourth quarter of 2026, supporting automotive and industrial sensing programmes moving towards production in 2027.
ExpressPCB has widened its checks across printed circuit board layouts. Version 3.4 examines spacing between all objects, improves fault navigation, and restores SnapMagic downloads, while fabrication suitability still requires engineering review.
Japanese partners have disclosed remote tunnel inspection networking trial results. A March demonstration used optical and wireless communications to transfer three-dimensional measurements and inspect 0.2mm cracks across a simulated 1,000km connection.
TrendForce expects tighter supply of specialised capacitors used in servers. Its October bulletin links growing CPU and DDR5 demand to high-capacitance MLCC pressure, with shortages forecast to be most severe in the first half of 2027.
TrendForce forecasts a major global optical fibre shortage for 2026. Its research estimates a 180-million fibre-kilometre supply gap, with production constraints and data centre demand contributing to higher spot prices and longer procurement commitments.
Omdia reports rising component costs across global LED display manufacturing. Second-quarter shipments increased despite lower industry revenue, while manufacturers face higher chip, driver IC, PCB and power supply costs alongside changing demand for premium displays.
Saxony and Arizona have renewed cooperation across their semiconductor industries. Economic development agencies used SEMICON West to connect suppliers, manufacturers and research organisations, although no new binding investment or production agreement was announced.
ST has reported space qualification for its quad LVDS receiver. RHFLVDS42 transfers data up to 600Mbit/s, with specified radiation resistance; individual ordering grades and screening evidence require confirmation.
Keysight expands digital-layer error testing for optical and copper interconnects. FITS-16CH doubles transmit and receive channel density to 16 each; FEC analysis and automatic lane tuning require the Advanced Option.