Category: Electronics
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Solstice is acquiring Element Solutions in a major $14.5bn deal. The combined business will target electronics materials, AI infrastructure, and thermal management.
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Kioxia has started sampling 332-layer BiCS FLASH enterprise memory devices. The NAND technology targets enterprise and data-centre SSDs for AI workloads.
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Socionext is now developing an A14 compute chiplet validation platform. The device will validate CPU and xPU architectures for AI infrastructure.
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Data-centre power design is shifting rapidly toward higher-voltage distribution architectures. Rack-level storage and solid-state protection are becoming central to AI infrastructure engineering.
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Q2 2026 made electronics design constraints much harder to ignore. Memory, packaging, optics, EDA automation, edge AI, and power delivery all carried forward existing pressures, while adding sharper evidence of how advanced systems are now limited by more than processors alone.
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eMaint has launched its first global maintenance partner network today. The Fluke business is formalising implementation, certification, and service support across industrial CMMS and EAM markets.
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Dynex Semiconductor has developed a high-current 650V GaN power module. The 450A half-bridge design uses PCB embedding and double-sided cooling for dense industrial power conversion.
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Oriole Networks is deploying photonic AI networking with AMD hardware. The UK startup’s PRISM platform will be tested inside ARIA’s Scaling Inference Lab for latency, throughput, and accelerator utilisation.
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Kimball Electronics has acquired Dutch medical CDMO Helvoet Polymer Technologies. The €90m deal expands micro-moulding and precision manufacturing capability for diagnostics, microfluidics, and drug delivery.
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Berlin researchers have reached certified CIGS-perovskite tandem cell efficiency records. The 25.5% result strengthens thin-film photovoltaic development where interfaces, stability, and manufacturable scale remain decisive.