Category: Electronics
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Navitas has unveiled direct 800V-to-6V power delivery for AI racks. Its new GaN-based board removes the 48V stage and targets higher efficiency, density, and board-level integration.
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March exposed where power in electronics now truly sits globally. Silicon still set the pace, but memory, power, optics, packaging, and design infrastructure increasingly shaped who could build, ship, and scale.
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CEA and PSMC are combining photonics, RISC-V, and 3D packaging. The tie-up brings silicon photonics, microLED links, and open compute IP into interposer-based AI architectures aimed at easing bandwidth and power constraints.
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SmartRay has brought reflective-surface inspection into its ECCO X family.
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MaxLinear has secured a longer runway for legacy SHDSL designs.
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Alexander Battery Technologies is expanding its battery engineering bench strength.
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Taoglas is shrinking multi-radio antenna integration into tighter device footprints. Its new FXP30x and PC30x families combine cellular, GNSS, and Wi‑Fi support in flexible and rigid PCB formats for compact connected products.
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Zel Components has launched a new platform for certified sourcing. The site combines sample-led evaluation, vetted manufacturing partners, and local inventory to widen access to alternative parts across Europe.
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Delta is bringing a tightly integrated electronics stack to LogiMAT. Charging, 3D time-of-flight vision, motion control, industrial computing, and robotics are being shown as one coordinated intralogistics platform.
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MARS Bioimaging has secured FDA clearance for portable photon-counting CT. The decision opens the US market for a compact upper-extremity imaging system built around detector technology originally developed through CERN’s Medipix3 work.