Category: Electronics
-
Infineon has opened its €5bn Smart Power Fab in Dresden. The site doubles local power semiconductor and analogue/mixed-signal capacity for AI infrastructure, grids, renewables, vehicles, and industrial systems.
-
Vertiv has opened a Malaysian facility for AI infrastructure manufacturing. The Johor site supports power, cooling, testing, and modular deployment.
-
Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
-
FTG has opened its first Indian aerospace electronics manufacturing facility. The Hyderabad site adds cockpit, avionics, and high-reliability electronics capacity.
-
MKS is expanding Atotech manufacturing capacity for AI infrastructure demand. The Guangzhou investment targets semiconductor, advanced packaging, and PCB process equipment.
-
Kingboard has raised funds to expand advanced PCB production capacity. The placement supports laminate, multilayer, HDI, and R&D investment.
-
Somacis has completed the Group ACB deal, expanding PCB capacity. The move adds French and Belgian manufacturing sites to a wider high-reliability electronics platform.
-
Keysight and WIN have linked GaN MMIC design workflows tightly. The environment joins simulation, layout verification, and evaluation-board optimisation before tapeout.
-
Rocket Lab has agreed to acquire satellite operator Iridium Communications. The $8bn transaction combines launch, spacecraft manufacturing, L-band services, IoT, and PNT capability.
-
SK keyfoundry has integrated EMC protection into automotive semiconductor designs. The Bi-SCR technology targets PMICs, motor drivers, and power-control ICs.