Category: Electronics
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Thintronics has been recognised for low-loss dielectric materials development work. Its materials target boards, packages, and semiconductor interconnect structures.
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La Luce Cristallina releases beta 200mm wafers for photonics evaluation. The BaTiO₃ platform targets low-voltage electro-optic modulator designs.
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Incap has added cleanroom assembly capability at its Slovak facility. The Námestovo site now supports ISO 6–7 controlled electronics production.
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STMicroelectronics has introduced secure silicon for post-quantum mobile services integration. ST54M combines NFC, eSIM, embedded secure element, and cryptographic acceleration in one die.
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Microchip has introduced a radiation-tolerant clock generator for spacecraft systems. The DSA504RT provides six programmable outputs for low-jitter aerospace and defence timing.
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Inelco Hunter has added Amphenol liquid-cooling connectors for power-dense systems. The range targets AI data centres, EV charging, storage, and energy infrastructure.
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SEMI will centre its materials conference on AI-era semiconductor constraints. The programme covers materials, packaging, quantum devices, manufacturing scale-up, and supply resilience.
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Micron and Anthropic are linking AI infrastructure to memory architecture. Their agreement covers HBM, DRAM, SSDs, supply, and workload-level optimisation.
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IBM has demonstrated sub-one-nanometre chip technology using a nanostack architecture. The research targets future gains in logic density, SRAM scaling, and energy efficiency.
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Acbel is bringing integrated EV power conversion systems to Munich. The showcase includes 400V and 800V onboard charger and DC/DC converter architectures.