Category: Electronics
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BrainChip has introduced Sequora processor IP for embedded sequence processing. Its state-space architecture is intended to limit context-related memory growth while supporting generative models on selected edge hardware.
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Eliyan has introduced sampling optical chiplets for AI interconnect architectures. Nexus and Oscar connect high-speed electrical links with parallel microVCSEL and photodiode arrays through separate interface functions.
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Microchip has launched a radiation-tolerant converter for spacecraft electronic systems. The POL-05-20S-T uses GaN devices to supply up to 20A with published radiation and temperature characteristics.
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NVIDIA has expanded CUDA-X software tools for semiconductor engineering applications. New atomic simulation functions accompany GPU-accelerated wafer modelling, inspection and test workflows used by industry software partners.
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Bulgin has expanded its sealed circular connector range with hybrids. The 6000 Series combines two specified 16A power contacts and lower-current signal positions in one interface.
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Rohde & Schwarz has introduced new thermoelectric RF power transfer standards. Its NTS family provides coaxial and waveguide configurations for traceable calibration applications at frequencies reaching 170GHz.
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IBM and Siemens are collaborating on future nanostack transistor technology. Their research combines device modelling, design automation and lithography simulation before any proposal for scalable manufacturing is established.
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Rohde & Schwarz has introduced its new compact ADD607 antenna system. The unit covers 9MHz to 20GHz and uses switchable active and passive elements for mobile radio monitoring applications.
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Spectrum has added FPGA averaging to its digitizer product family. The new firmware processes repeated waveforms inside the instrument, reducing transferred data without changing the analogue converter’s native resolution.
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FormFactor and Teradyne have agreed a semiconductor testing technology partnership. Teradyne also plans a $300m equity investment, subject to regulatory approvals, as the companies target advanced packaging and memory qualification.