Category: Electronics
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Silvaco and Dassault Systèmes are linking semiconductor manufacturing simulation workflows. The partnership connects plasma, feature-scale process, and structural models before engineers commit expensive fab resources.
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IBM has connected two cryogenic modules for larger quantum systems. The architecture is designed to support denser interconnects, multi-chip processors, and future fault-tolerant machines.
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TekSiC has advanced European semi-insulating silicon carbide wafer supply efforts. GaN epitaxy has now been grown on the Swedish wafers ahead of RF and power HEMT validation.
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TE Connectivity has launched its SCHRACK RSY industrial relay family. The compact PCB platform combines 10A switching, extended thermal operation, low-load contact reliability, and a lower product carbon footprint.
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CACI has opened expanded defence electronics manufacturing capacity in Rochester. The 61,000ft² facility adds more than 300% manufacturing space for software-defined electronic warfare programmes.
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Micron has launched a decade-long programme for advanced semiconductor research. The planned $10bn investment spans future memory, compute architectures, advanced packaging, and manufacturing technology.
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Marvell has expanded its custom silicon relationship with Google further. The agreement spans AI accelerators, storage, networking, memory-interface control, and near-memory computing linked to Google’s TPU infrastructure.
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Socionext is extending its custom SoC roadmap to Intel 18A-P. Its first development is a high-performance compute chiplet targeting AI, HPC, edge, and data-centre systems.
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Singular Photonics has secured new funding for advanced SPAD sensors. The £1.6m round will expand engineering capacity and accelerate new image sensors for industrial, scientific, and medical applications.
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Terma and Danube Cell will combine battery development and testing. The agreement links European cell engineering with regenerative test systems for aerospace, defence, and other demanding applications.