Category: Electronics
-
LitePoint has validated STMicroelectronics’ next-generation UWB silicon against emerging standards. Testing with IQgig-UWB+ covers PHY performance for the ST64UWB family as IEEE 802.15.4ab develops longer-range ranging and sensing capabilities.
-
Molex has invested in CAEPlus to advance active liquid cooling. BoundaryCool targets increasing processor heat loads in AI and high-performance computing infrastructure.
-
TTM Technologies has agreed a $1.1 billion Epiq Solutions acquisition. The transaction extends its manufacturing portfolio into software-defined radios, embedded computing, and space electronics.
-
India has approved 31 additional electronics manufacturing projects across states. The package expands domestic production across components, materials, sub-assemblies, and manufacturing equipment.
-
Space Forge has selected Texas A&M for US semiconductor manufacturing. Initial work will combine material growth, processing, and characterisation before the collaboration expands into further joint research.
-
Avnet Silica says semiconductor growth is tightening component availability again. Its Q3 Trendliner identifies allocation, rising lead times, and greater planning risk across several component classes.
-
ATLANT 3D has launched its NANOFABRICATOR PRO atomic manufacturing platform. The system connects computational materials discovery with fabrication, experimental validation, and device prototyping.
-
SweGaN has raised $14 million to expand GaN-on-SiC production capacity. The funding will also support infrastructure, commercial expansion, and development of next-generation epitaxial materials.
-
Applied Materials reports record revenue as semiconductor equipment demand strengthens. DRAM, leading-edge logic, advanced packaging, and collaborative R&D are supporting further capacity investment.
-
Flip Electronics adds Vishay parts to its authorised obsolescence channel. The agreement targets traceable end-of-life discrete semiconductors used in long-lifecycle electronic equipment.