Category: Electronics
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Farnell has expanded its EMEA range of Amphenol NEXUS connectors. The portfolio covers military audio, waterproof breakaway, TAC and Ranger products for demanding communications and control equipment.
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Pasqal is now moving Europe’s Q-PLANET pilot line into implementation. The €50 million programme targets industrial-grade neutral-atom components, standardised design kits and repeatable fabrication.
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JEDEC has published its first silicon photonics reliability standard JESD264. The framework covers qualification, manufacturing controls and responsibility across photonic dies, integrated chipsets and their supporting supply chain.
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Ekinops will expand Bluebird Fiber’s Midwest network towards 400G services. The multi-year deployment uses coherent DWDM technology across a 36,000-route-mile fibre footprint spanning 12 US states.
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Q3 2026 pushed established electronics constraints deeper into production systems. HBM4, silicon photonics, 800VDC, agentic EDA and CRA reporting all gained firmer operational footing.
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TDK has demonstrated a 150nm meta-optic mirror for retinal displays. The transparent nanostructure replaces curved optics and is designed for semiconductor-style manufacture.
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EPC has demonstrated GaN conversion from 800V to processor cores. Its 6kW platform steps to 6V before a 5MHz stage delivers 0.9V at 11A.
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Toshiba has halved threshold drift in trench-gate silicon carbide MOSFETs. Revised gate-interface processing improves long-term stability while retaining low on-resistance.
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onsemi and Synaptics have rewritten terms for their planned merger. The amended agreement replaces the original stock transaction with $123-per-share cash consideration.
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Applied Materials and Besi are expanding advanced packaging collaboration further. The programme adds TCB, panel integration, and photonics work through Applied’s EPIC Center.