NVIDIA is building financing platforms for large AI infrastructure projects. Six financial groups have signed memorandums intended to mobilise more than $500 billion of third-party capital over time.
NetSense uses existing 5G networks to detect and track drones. The Lockheed Martin-led system combines RF sensing, AI processing, and commercial cellular infrastructure, with pilots planned from late 2026.
Navitas has sued Renesas over four US gallium nitride patents. The Texas action adds a patent dispute to the companies’ separate trade-secret litigation over GaN technology.
Soctera has raised $4m to develop thermally optimised mmWave amplifiers. The Cornell spin-out is moving a III-nitride semiconductor architecture towards qualified products for radar, electronic warfare, satellite, and telecommunications systems.
Samsung is reportedly targeting High-NA EUV adoption from 1nm production. The roadmap would delay production insertion while the foundry evaluates the economics and process maturity of ASML’s 0.55-NA lithography platform.
NXP has broken ground on its expanded Malaysian test facility. The Petaling Jaya project adds around 500,000 square feet of production space and is intended to more than double site output at full capacity.
Jenoptik semiconductor equipment orders accelerated sharply during 2026’s first half. Lithography and inspection demand lifted the unit’s order intake by 85.3%, while revenue rose 10.2% and further optics capacity is planned in Jena.
South Korea plans a five-trillion-won fund for semiconductor supply chains. The programme will target materials, components, equipment, and fabless companies alongside another five trillion won in trade finance.
Vishay has launched surface-mount Y1 safety capacitors for industrial filtering. The SMDY1…S series combines 300VAC and 1,500VDC ratings with capacitances to 1,500pF and up to 40% lower board-space requirements.
UC Berkeley will join Applied Materials’ EPIC semiconductor research centre. Researchers will gain access to industry-scale process equipment intended to shorten the route between university materials research and chip manufacturing.