Category: Electronics
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UCLA scientists cut flicker noise in nanowires for sensors dramatically. The team demonstrated an ultra-low-noise transport regime in quasi-1D materials, indicating a path toward higher-fidelity medical sensing and more stable quantum devices.
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Keysight and Point2 are testing RF interconnects for AI clusters. The companies are using Keysight BERT and sampling scopes to characterise Point2’s e-Tube plastic-waveguide links at multi-terabit data rates.
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Munich researchers have built Europe’s first 7nm AI chip prototype. The RISC-V, neuromorphic design targets ultra-low-power on-device inference, with an eye on security-sensitive industrial and medical workloads. TUM’s MACHT-AI centre is backing further tape-outs on advanced FinFET nodes.
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Microchip has broadened its Cortex-M0+ microcontroller range again today, globally. The new PIC32CM PL10 family targets 5 V, noise-tolerant embedded control, with pin compatibility intended to ease migration from AVR Dx designs in industrial, appliance, and automotive subsystems.
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January’s electronics agenda narrowed around power, packaging, and policy constraints. CES announcements pushed compute into rack-scale platforms, while memory supply and advanced packaging capacity dictated what could realistically ship. Export controls and EU security obligations tightened the design perimeter around compliance, updateability, and regional configuration management.
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CSA Catapult is pushing vertical GaN as net-zero infrastructure enabler. A new white paper argues GaN-on-GaN vertical devices can handle higher voltages and power densities than lateral structures, with implications for EV charging, renewable grids, and data centre power conversion.
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Microsoft has detailed Maia 200, its latest inference accelerator silicon. Built on TSMC 3nm, the chip pairs FP8/FP4 tensor cores with 216GB HBM3e, targeting higher token-throughput per watt in Azure-scale deployments.
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Microservice Store is pitching a marketplace for embedded software blocks. Its Embedded Microservices model packages verified functionality as isolated native executables, aiming to let engineers patch devices component-by-component on MCUs as small as Arm Cortex-M0.
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BAE Systems has secured a $473m US Army Paladin order. The award covers 40 more M109A7 howitzer sets, including M992A3 ammunition carriers, plus support services. For electronics teams, the programme’s high-voltage electrical system and growing digital integration remain the upgrade pathway.
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A UMass-led system processes touch events using memristive hardware locally. Demonstrated in Nature Sensors, the architecture combines a flexible haptic sensor array with event-triggered circuitry and a memristive system-on-chip to cut energy and latency versus conventional digital sensing pipelines.