Category: Electronics
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MetaOptics is taking metalens prototyping equipment into Stanford’s nanofabrication ecosystem. Its Direct Laser Writer targets rapid 4-inch-wafer prototypes and small-volume pilot production.
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Lightmatter coalition formalises open architecture work for co-packaged optics systems. The 19-company OCP initiative is moving towards shared specifications for large, multi-vendor AI compute clusters.
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Quanta and Quantinuum bring manufacturing engineering into quantum hardware systems. Joint development targets modular infrastructure capable of supporting future commercially deployable fault-tolerant machines.
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Lam Research plans $3 billion expansion of semiconductor R&D laboratories. The five-year programme targets more than 50% additional experimental capacity across its global development network.
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Aehr has secured another major AI processor burn-in production order. The $22m deal covers automated FOX-XP systems configured to process nine 300mm wafers simultaneously before advanced packaging.
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Sony and TSMC formalise their Kumamoto image-sensor manufacturing joint venture. The binding agreement commits about ¥747 billion between the companies, with volume production of next-generation sensors targeted for 2029.
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Movellus is bringing on-die power optimisation to Samsung advanced nodes. The Aeonic platform adds telemetry and nanosecond-scale control loops for AI and HPC SoCs through Samsung Foundry’s SAFE ecosystem.
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Koh Young will double inspection equipment capacity at Yeoju complex. A second 12,800-square-metre production centre is due in August 2027 as AI-server and advanced-semiconductor demand increases.
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Mycronic has secured another SLX order from a new customer. The $4m–$6m Asian order broadens the platform’s installed base, with delivery of the semiconductor photomask writer planned for Q1 2027.
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Sivers and SemiNex target InP light sources for data centres. The $3.4 million programme covers co-packaged optics, DFB laser arrays, and optical amplifiers, with sampling targeted for the second half of 2027.