Category: Electronics
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Aehr has secured additional Sonoma orders for AI processor burn-in. The $6 million package supports a second processor programme ahead of a planned 2027 production ramp.
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Navitas has completed its Claros acquisition for processor power delivery. Integrated voltage regulation moves the final conversion stage closer to high current AI processors.
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Teradyne has extended Titan HP into semiconductor reliability burn-in testing. The platform controls each device’s junction temperature while running representative operating workloads.
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Anritsu and CANDOX validated chamberless 60 GHz production testing methods. Near-field measurements correlated with certification results without requiring a large anechoic chamber.
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Trio-Tech has secured another European automotive semiconductor burn-in equipment contract. The $4.45 million award covers hardware, maintenance and technical support at an additional customer location.
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Infineon and ZuriQ are scaling trapped-ion quantum processors through manufacturing. Their expanded programme combines chip fabrication, packaging and photonics with a two dimensional ion architecture.
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Flir has added four Meterlink instruments for connected field diagnostics. The range covers EV charger analysis, thermal electrical troubleshooting and HVAC environmental measurement.
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PCTEL has added Wi-Fi 6E measurements to SeeHawk Touch workflows. The update brings 2.4, 5 and 6 GHz Wi-Fi into combined field testing with cellular and critical communications networks.
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TDK has increased PoC inductor impedance for automotive camera links. The new 1.25 µH MLJ1608-G component keeps the same compact multilayer package.
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Keysight has connected AI agents directly with RF design software. ADS 2027 exposes documented tools, recorded workflows and simulation functions for circuit generation, verification and optimisation.