ECSA has opened 2026 applications for its microelectronics summer school. The Bologna programme runs in late August, covering semiconductor technology, IC design, embedded intelligence, and integration, with a focus on building the engineering pipeline Europe’s chip projects will need.
Omron’s S8AS2 targets crowded control cabinets with smarter DC distribution. It combines a 24 V power supply, branch-level electronic protection, and live diagnostics, aiming to simplify wiring and isolate faults without taking an entire panel offline.
Renesas will license EPC’s eGaN for low-voltage power devices globally. The deal adds second-sourcing and aims to accelerate GaN adoption in AI power, robotics, and compact converters.
Samsung will co-develop chip processes at Applied’s new EPIC Center. The $5bn facility targets atomic-scale patterning, etch, deposition, and extreme 3D integration across logic and memory.
Industrial touchscreens have stripped tactile feedback from many HMIs today. Ross Turnbull, Director of Business Development at Swindon Silicon Systems, explains how custom ASICs enable precise, closed-loop haptics that makes digital panels feel more like physical controls.
Teledyne FLIR OEM has launched a new long-range thermal ISR camera. The Neutrino SX8 ISR 50-1000 extends detection ranges for border, perimeter, and counter-UAS applications, with a factory-integrated continuous zoom lens and AI-ready architecture.
Infineon is shipping isolated gate drivers aimed at SiC inverters. The 1ED301xMC12I family uses an opto-emulator input to replace optocouplers without a PCB redesign, while tightening timing, noise immunity, and switching behaviour.
ZOLL’s Zenix monitor-defibrillator has cleared the EU MDR process now. The approval supports European rollout of a touchscreen-based professional monitor/defibrillator for EMS and hospital teams, with real-time CPR and ventilation feedback features.