Category: Electronics

SYNOPTICS has grown record-scale Yb:YLF crystal material for fusion lasers. A finished 127 mm slice will support DESY’s development of 200 J-class laser modules.

IBM has connected two modular cryogenic systems for quantum scaling. The joined environment cooled below 15 millikelvin and provides substantially more wiring space for future multi-chip systems.

Cornell researchers cut tantalum deposition temperatures using krypton sputtering techniques. The process forms the required bcc phase on silicon at 200°C and broadens compatibility with semiconductor fabrication.

Nisshinbo has developed silicon packaging that integrates both board surfaces. Its window-comparator prototype cut mounting footprint by about 80 per cent while combining IC dies and passive components.

SRC has launched SPARC to accelerate industry-led semiconductor university research. The initial $13 million portfolio covers 21 projects spanning devices, manufacturing, advanced packaging, and analogue and mixed-signal technologies.

KTR has established an FR3 testbed using Anritsu’s MT8000A platform. The installation extends its 4G and 5G facilities towards 6G research, verification, standardisation, and future certification work.

Avicena is now shipping 1Tbps LightBundle kits for customer evaluation. The microLED platform combines 335 optical channels at up to 3Gbps each, giving AI hardware developers a laboratory route to test short-reach optical links.

Coherent has begun sampling 300mm silicon carbide substrates to customers. The material targets heat spreading in AI and HPC packaging, with the company claiming up to 25% better performance than current solutions.