Category: Electronics
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Tower and Semtech have expanded capacity for silicon germanium components. The multi-year commitment spans foundries in the United States, Israel and Japan.
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Navitas has unveiled a 24kW board for AI power distribution. The design converts 800V DC directly to 12V, targeting 97% efficiency at full load.
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EXFO has launched portable HyperBlazer testing for high-speed optical links. The 100GE–800GE platform combines fast transceiver checks with longer Ethernet and bit-error measurements.
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Faraday has released silicon-proven dual-protocol MIPI IP for advanced sensors. Its 14nm design supports C-PHY and D-PHY interfaces while sharing circuits to reduce area.
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Nikon has confirmed its DSP-110 digital lithography system specifications today. The advanced packaging tool is due for release in April 2027, offering 72 panels an hour under defined test conditions.
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ams OSRAM has joined a new optical interconnect standards effort. The Credo-led Open Compute Project workstream will address parallel micro-emitter links, building on existing VCSEL demonstrations and targeting a common specification in 2027.
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Polar will manufacture enhancement-mode GaN devices using technology from imec. The US foundry has agreed a process transfer covering initial 40V-to-650V devices, while IC-Link will provide a path from design work towards commercial manufacturing.
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Credo has outlined a parallel optical cable for AI infrastructure. Its proposed 1.6T ZeroFlap design divides high-speed electrical lanes among lower-rate optical channels, with a target reach of 50 metres and shipments planned for 2027.
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Lumentum and partners will demonstrate optical PCIe links within racks. Their proof of concept combines 1060nm VCSEL arrays, Corning multimode fibre and Astera Labs Scorpio switching, targeting parallel 32Gb/s NRZ channels and an error-free PCIe 5 link.
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Power Integrations and Ideal Power are developing semiconductor circuit breakers. Their working 800V DC prototype combines a 1700V InnoMux-2 power conversion device with B-TRAN switching, while a reference design remains in development.