Category: Electronics
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Applied Materials has unveiled its completed EPIC semiconductor research facility. The Sunnyvale centre combines cleanroom equipment with chipmaker and university research programmes, while the planned $5bn investment will scale with partner projects.
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Fibocom has introduced its new SC153 5G smart computing module. The Qualcomm-based design combines sub-6GHz connectivity, Android processing and multiple hardware interfaces, with volume production scheduled for the fourth quarter.
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SEMI has raised its global semiconductor equipment spending outlook again. The latest forecast anticipates $227bn of 300mm fab investment in 2029, alongside more facilities entering construction and production.
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Lightmatter has demonstrated two optical systems for accelerator rack interconnects. The switch and compute trays use separate collaborations and Open Compute Project-aligned hardware.
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Tower and Semtech have expanded capacity for silicon germanium components. The multi-year commitment spans foundries in the United States, Israel and Japan.
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Navitas has unveiled a 24kW board for AI power distribution. The design converts 800V DC directly to 12V, targeting 97% efficiency at full load.
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EXFO has launched portable HyperBlazer testing for high-speed optical links. The 100GE–800GE platform combines fast transceiver checks with longer Ethernet and bit-error measurements.
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Faraday has released silicon-proven dual-protocol MIPI IP for advanced sensors. Its 14nm design supports C-PHY and D-PHY interfaces while sharing circuits to reduce area.
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Nikon has confirmed its DSP-110 digital lithography system specifications today. The advanced packaging tool is due for release in April 2027, offering 72 panels an hour under defined test conditions.
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ams OSRAM has joined a new optical interconnect standards effort. The Credo-led Open Compute Project workstream will address parallel micro-emitter links, building on existing VCSEL demonstrations and targeting a common specification in 2027.