India is moving deeper into very low Earth orbit hardware. BEL and Bellatrix Aerospace are pairing mission electronics, payload development, and propulsion expertise for satellite platforms built specifically for VLEO operations.
Lead-times are lengthening again as component pricing turns upward globally. Anglia is urging manufacturers to secure 12 months of demand before tighter inventories, memory allocation limits, and longer MCU schedules harden across 2026.
Embedded World returns to Nuremberg this week under heavier pressure. The demos will draw the crowds, but the useful conversations sit around compliance, edge AI, long-life silicon, and power budgets that still refuse to get any friendlier.
Everspin Technologies has completed production qualification of its 64Mb high-reliability xSPI MRAM, extending the use of persistent memory in industrial, medical, aerospace, and other applications requiring robust operation under extreme conditions.
AI interconnect optics are moving faster, denser, and more secure. Marvell’s latest coherent launch pushes pluggable bandwidth to 1.6T while tightening the link between optical reach, power efficiency, and built-in encryption.
LurexX is licensing IMSE to model and validate in-mold lighting. The partnership adds optical simulation and measurement to TactoTek’s smart-surface ecosystem, supporting dynamic surface illumination and light lines within ultra-thin moulded structures.
ST’s STM32C5 puts Cortex-M33 performance into entry-level designs everywhere today. A 40nm platform, up to 1MB Flash, and security features bring faster control and richer connectivity into cost-sensitive smart devices.
Dymax will demo UV curing workflows at APEX EXPO 2026. The booth programme centres on PCB-level adhesives, coatings, and maskants, pairing automated dispensing with UV/LED curing demonstrations aimed at reliability challenges including outgassing, component stability, and environmental protection.
Teledyne releases wideband limiter to protect EW receiver front-ends hardware. The passive 0.1–20 GHz module is built to absorb high-power RF before it reaches sensitive electronics, with SMA connectors and fast recovery aimed at retrofit protection in R-ESM and EW systems.