Category: Electronics
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Silicon Motion has advanced its Cyber Resilience Act readiness programme. The controller supplier has aligned security processes with EU reporting duties taking effect on 11 September, while stopping short of claiming full compliance.
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IQE will supply six-inch GaAs epiwafers for Quintessent laser sampling. The agreement extends a decade-long materials relationship as quantum-dot optical technology progresses through customer evaluation towards commercial production.
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Sivers will invest $30 million expanding Glasgow photonics manufacturing capacity. The programme targets annual production above 100 million CW DFB lasers as optical-interconnect customers move towards higher volumes.
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SUSS and Manz Asia will jointly develop semiconductor inkjet systems. The collaboration targets advanced and panel-level packaging, where selective deposition could reduce material consumption while supporting increasingly complex package structures.
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Verasonics has expanded international protection for its ultrasound transceiver architecture. New grants cover five countries, while a US provisional filing extends active-clamp work around high-voltage transmission and concurrent receive measurements.
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Electroninks has formed an advanced packaging partnership with two suppliers. EMD Electronics will establish an application laboratory at Qualipoly to accelerate conductive-material qualification and process development.
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Syrma SGS Elemaster has opened a new Bengaluru electronics plant. The 20,000 sq ft facility combines SMT, through-hole, and box-build assembly for high-reliability industrial, medical, transport, and energy applications.
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GlobalFoundries has released PDKs for two new UX process platforms. 40UX targets ultra-low-power MCUs and connectivity, while 22UX adds analogue, sensing, imaging, and edge-AI capability.
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Innolux has unveiled Chip-Last FOPLP for advanced semiconductor packaging production. Its HIPoS platform uses 620 × 670mm panels and targets 2/2µm redistribution-layer geometry ahead of planned 2027 mass production.
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GlobalFoundries and RAAAM have taped out GCRAM test silicon successfully. Their FDX implementation targets 40% less memory area and power reductions reaching 60% against conventional SRAM.