Category: Electronics
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Antaira Technologies has achieved SEMI E187 certification for industrial switch solutions used in semiconductor manufacturing, underlining the rising importance of embedded cybersecurity controls inside fab infrastructure.
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Infineon is contributing manufacturing and engineering expertise to three European quantum pilot-line projects, linking quantum device research more directly with industrial semiconductor processes and scale-up.
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EIZO Rugged Solutions has launched a 24.1-inch rugged LCD monitor for ECDIS, radar, and integrated bridge navigation roles in naval and maritime systems.
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SEMI is using its June policy forum in Brussels to push for a more comprehensive Chips Act 2.0, with the agenda moving beyond fab announcements toward resilience, competitiveness, skills, security, and the harder work of building a durable European semiconductor ecosystem.
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Farnell has added Lovato Electric’s automation and protection hardware to its industrial portfolio, bringing contactors, switch disconnectors, motor-protection relays, safety devices, signalling products, and circuit-protection components into a broader stocked channel for control and power applications.
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ASML posted €8.8 billion in first-quarter net sales and lifted its full-year outlook, reinforcing how AI-driven fab investment is continuing to shape lithography demand.
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Microelectronics US 2026 opens in Austin next week with more than 100 speakers across semiconductor, photonics, and embedded tracks, focusing on engineering execution rather than grandstanding around future technologies.
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Zephyr RTOS 4.4 brings WireGuard, Wi-Fi Direct, OpenRISC support, and a shift to Zephyr SDK 1.0 and C17, extending the open-source RTOS further into secure networking, open hardware, and embedded vision work.
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Nordson Electronics Solutions has taken the 2025 EM Asia Best Supplier of the Year award, adding further weight to its position in Asian electronics manufacturing equipment markets spanning dispensing, coating, selective soldering, and plasma treatment.
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TPK and ASE are moving into through-glass via packaging with a pilot line planned for the third quarter of 2026, adding another sign that glass-core substrates are edging closer to practical deployment in high-performance semiconductor packaging.