Category: Design engineering
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Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
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Siemens and Samsung Foundry are extending advanced-node EDA collaboration flows. The work covers verification, test, packaging, analogue, RF, and implementation.
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RISC-V Summit Europe has opened in Bologna around deployable hardware. The programme spans embedded systems, AI, automotive, security, software, and space.
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CEA-Leti and GlobalFoundries are extending FD-SOI research through Europe’s FAMES. The pilot line targets low-power, sovereign silicon for advanced applications.
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Keysight will manage Leonardo UK test equipment for five years. The agreement covers calibration, repair, digital asset management, and lifecycle support across UK sites.
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CGD and NXP are collaborating on GaN power-conversion system designs. The work targets data-centre, automotive, and industrial designs needing higher efficiency and density.
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CSA Catapult will become the UK’s Semiconductor Catapult this summer. The transition broadens support for chip R&D, validation, commercialisation, and AI hardware deployment.
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Zollner has expanded its Zandt headquarters with new capacity. The building adds high-precision mechanics, cleaning, coating, and defence-related manufacturing capability.
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Celera has acquired SiliconGate to expand analogue IC design capability. The deal adds Portuguese power-management expertise, silicon-proven IP, and design capacity for custom semiconductor development.
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Microchip has updated TimePictra for resilient critical infrastructure synchronisation management.