Category: Design engineering
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GÖPEL has automated boundary-scan programme generation within CASCON 4.11 software. The release also expands analogue measurement, netlist analysis, and processor-emulation functions.
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Europe’s processor programme has completed its second major development stage. Demonstrations covered Rhea1 silicon, RISC-V acceleration, scientific software, design tools, and memory compression.
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Keysight is bringing guided structural simulation into electronics development workflows. Multiphysics begins with drop, shock, and vibration analysis before prototyping.
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Siemens is extending SoC automation through its Defacto Technologies acquisition. The deal connects RTL creation, implementation assessment, and verification within a broader EDA flow.
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Drive System Design will build VÆRIDION’s twin-motor propeller transmission hardware. The architecture combines electrical redundancy with one shared propeller.
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In2tec has made JLR headlamp electronics recoverable through reversible bonding. Project Cornerstone tests circular assembly methods under automotive conditions.
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Siemens and Cloudberry are linking European deep-tech developers with industry. The collaboration combines validation environments, engineering support, and specialist capital.
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HFI is building a consistent pre-boot environment for RISC-V systems. The project adds hardware enumeration, setup, diagnostics, boot selection, and firmware flashing above U-Boot.
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Cadence has extended agentic automation across PCB and package design. AuraStack coordinates planning, layout, manufacturability, and multiphysics analysis within one engineering environment.
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Arduino has expanded Modulino for longer distributed embedded prototype networks. New boards add eight-branch I²C expansion, extended cabling, and local motor control.