Category: Design engineering
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Blueshift is presenting PhaseBlue circuit material for RF PCB designs.
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QPT has launched qDesign for AI-optimised power module packaging workflows.
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ODU has supplied mass interconnects for automated DEIF converter testing.
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onsemi has launched a SiC pairing tool for power designers.
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EnSilica has secured a seven-year automotive semiconductor supply contract. The UK fabless chipmaker will manufacture and supply an Arm-based sensing device already in production for a German automotive components customer.
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Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.
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Power Integrations has introduced compact 800VDC auxiliary PSU designs. The 15W and 35W flyback references use 1700V PowiGaN InnoMux-2 ICs for high-voltage AI data-centre architectures based on NVIDIA Kyber.
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Atomera is targeting RF GaN-on-silicon performance with MST processing. The approach uses an oxygen-modified silicon layer to reduce parasitic channel charge, aiming to narrow the performance gap between lower-cost silicon substrates and established RF GaN-on-SiC platforms.
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Astute Group has added UK stock of ATS thermal management products for NVIDIA Jetson modules. The range covers active heatsinks, passive options, and thermal transfer plates for robotics, edge computing, smart monitoring, and physical AI systems.
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JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.