Category: Design engineering
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Makr Microsystems has raised funding for subsurface semiconductor metrology development. Its Acoustic Atomic Force Microscopy platform targets buried structures and defects that become harder to inspect as semiconductor devices and packages extend further into three dimensions.
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Silicon Line has launched a dual-port 20Gbps MIPI SerDes chipset. The architecture extends camera links over optical fibre or differential copper while limiting interconnect power in constrained imaging systems.
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Anritsu and MediaTek have verified Release 17 coverage-enhancement tests together. The work exercises uplink mechanisms intended to improve 5G reliability at cell edges, deep indoors, and in other weak-signal conditions.
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Peer Software is accelerating Würth Elektronik’s global CAD collaboration workflows. PeerGFS synchronises engineering data across three continents, providing local file access while controlling conflicting edits and supporting recovery after infrastructure failures.
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Microchip and Marelli have demonstrated open automotive display connectivity together. The implementation streams centrally generated graphics and video over ASA Motion Link, extending standards-based SerDes into software-defined vehicle display architectures.
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SUSS and Manz Asia will jointly develop semiconductor inkjet systems. The collaboration targets advanced and panel-level packaging, where selective deposition could reduce material consumption while supporting increasingly complex package structures.
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Electroninks has formed an advanced packaging partnership with two suppliers. EMD Electronics will establish an application laboratory at Qualipoly to accelerate conductive-material qualification and process development.
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MIPS has launched three workload-native platforms for physical AI development. Acies targets inference, Actus real-time event processing, and Aegis safety-oriented mission-critical systems.
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QuickLogic has expanded eFPGA hard IP for GlobalFoundries 12LP technology. The architecture now scales beyond 250,000 LUTs while adding enhanced DSP functions and optional configuration-bit error monitoring.
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GlobalFoundries has released PDKs for two new UX process platforms. 40UX targets ultra-low-power MCUs and connectivity, while 22UX adds analogue, sensing, imaging, and edge-AI capability.