University researchers have validated bidirectional DC protection using SiC modules. The architecture targets medium-voltage DC grids, battery storage, renewable integration, vehicle-to-grid systems, and industrial power infrastructure.
Samsung has begun shipping 12-layer HBM4E samples to major customers. The devices target AI accelerators and data-centre systems with 48GB stacks, 14Gbps pin speed, and up to 3.6TB/s bandwidth.
Nextpower will acquire Prevalon Energy to expand its BESS platform. The deal adds battery storage hardware, intelligent controls, diagnostics, monitoring, and service capability for grid, data-centre, and industrial power systems.
Würth Elektronik has expanded its digital isolator range for I²C. The WPME-CDI2C family adds bidirectional galvanic isolation for industrial, battery, motor-control, sensor, and embedded designs.
Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.
P&N Europe is offering compact thermoelectric coolers for optical transceiver assemblies, targeting laser temperature stability in high-speed data centre, AI, telecom, and coherent optical links.
ROHM has released a web-based PLECS simulator that allows power electronics designers to evaluate losses, temperature rise, waveforms, and device selection during early circuit development.
xTool has launched the M2 Color Craft Laser in the UK, combining CMYK printing, laser cutting, engraving, dual cameras, and automated alignment in a desktop fabrication system.